Research of Multi-Axes Motion Control System Based on LabVIEW Platform

Abstract:

According to Dynamic Link Library (DLL), the common motion card was successfully run on Labview virtual platform, which can graphically compile program. Based on Labview8.6 platform, Leadtech SMC-6480 control card and Yaskawa SJME-02AMA41 servo motor were used as the hardware to realize multi-axes motion control. The results indicated that each axis has three motion models of automatic, manual and return-to-zero, which can switch mutually at any time.

• Periodical: Advanced Materials Research (Volume 569)
• Pages: 763-768
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.569.763
• Online since: September 2012
• Authors: Lu Hua Deng, Jun Hui Li, Ling Gang Liu
• Keywords: Dynamic Link Library, LabVIEW, Motion Control Card, Virtual Instrument (VI)

References

[1] R Gao, C Miao, Zh Wang. Design and exploitation on multi-axes motion control system based on LabVIEW . Journal of tianjin polytechnic university, 2008, 27(6): 58-61.

[2] U. Geissler, J. Funck, M. Schneider-Ramelow, H. J. Engelmann, I. Rooch,W. H. Muller, and H. Reichl, Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts, J. Electron. Mater., vol. 40, no. 2, pp.239-246, (2011).

DOI: 10.1007/s11664-010-1439-2

[3] B. I. Noh, J. M. Koo, J. L. Jo, and S. B. Jung, Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding, JPN. J. Appl. Phys., vol. 47, no. 5, pp.4257-4261, (2008).

DOI: 10.1143/jjap.47.4257

[4] S. Murali, N. Srikanth, and C. J. Vath III, Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds, Mater. Lett., vol. 58, no. 25, pp.3096-3101, (2004).

DOI: 10.1016/j.matlet.2004.05.070

[5] X Xiong , Application of Common Motion Control Card Based on LabVIEW. control & automation. 2006，139-141.

[6] Y. H. Tian, C. J. Hang, C. Q. Wang, G. Q. Ouyang, D. S. Yang, and J. P. Zhao, Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound, Microelectron. Reliab., vol. 51, no. 1, pp.157-165, (2011).

DOI: 10.1016/j.microrel.2010.06.004

[7] L. Han, F. Wang, W. Xu, J. Zhong, Bondability window and power input for wire bonding, Microelectron. Reliab., vol. 46, no. 2-4, pp.610-615, (2006).

DOI: 10.1016/j.microrel.2005.05.018

[8] Y Li. Design of Motion Control System Based on LabVIEW. China Science and technology information, (2009).

[9] J. Li, J. Duan, L. Han, and J. Zhong, Microstructural characteristics of Au/Al bonded interfaces, Mater. Charact. Vol. 58, pp.103-107, (2007).

DOI: 10.1016/j.matchar.2006.03.018

[10] H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, and Z. Chen A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads, Scripta Mater., vol. 61, no. 2, pp.165-168, (2009).

DOI: 10.1016/j.scriptamat.2009.03.034

[11] J. Li, L. Han, J. Duan, and J. Zhong, Interface Mechanism of Ultrasonic Flip Chip Bonding, Appl. Phys. Lett., vol. 90, p.242902, (2007).

DOI: 10.1063/1.2747673

[12] H. Ji, M. Li, J. Kim, D. Kim, and C. Wang, Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy, Mater. Charact., vol. 59, pp.1419-1424, (2008).

DOI: 10.1016/j.matchar.2008.01.001

[13] The software manuals of SMC-6480 four-axes motion control device. Version1. 0.

[14] X Qi , J Zhou, J Jiao. LabVIEW 8. 2 introduction to Chinese version with typical examples. Beijing: people's posts and telecommunications publishing house, (2010).

[15] H. Kim, J. Y. Lee, K. W. Paik, K. W. Koh, Effects of Cu/Al Intermetallic Compound (IMC) on Copper Wire and Aluminum Pad Bondability, IEEE T. Compon. Pack. T., vol. 26, no. 2, pp.367-374, (2003).

DOI: 10.1109/tcapt.2003.815121

[16] X Lin. Multi-Axes digital servo motor control system Based On LabVIEW. Science and technology information, 2009, (5) : 101-102.

[17] J. Li, Liu L., L. Deng, B. Ma, F. Wang, L. Han, Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding, IEEE Electr. Device L., vol. 32, No. 10, pp.1433-1435, (2011).

DOI: 10.1109/led.2011.2161749

[18] J H Zhang, J Zhang, L Yang, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film, J. Electron. Packaging, vol. 132, p.044501, (2010).

DOI: 10.1115/1.4002898

[19] H. Xu, C. Liu, V.V. Silberschmidt, S.S. Pramana, T.J. White, Z. Chen, V. L. Acoff. Behavior of intermetallics, aluminum oxide and voids in Cu-Al wire bonds., Acta Materialia. 2011, vol. 59, no. 14, pp.5661-5673.

DOI: 10.1016/j.actamat.2011.05.041