Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode

Li Qun Du; Li Chuan Yu; Lei Song; Chong Liu

doi:10.4028/www.scientific.net/AMR.60-61.202

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 60-61Effect of the Thickness Uniformity in...

Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode

Abstract:

In this paper, an effective method is presented to improve thickness uniformity in nickel electroforming process. In most electroforming processes, thickness ratio of edge to center is 2.5~4 and the shape of the electroforming zone is naturally a concave. Dividing conductive zone of electroforming structure to redistribute current density was applied to improve electroforming uniformity. Theoretical analysis and experimental results verify that a proper dividing method can improve the electroforming uniformity effectively. In the experiment, the thickness ratio of edge to center decreases from 2.91 to 1.88.