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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 626Real Time Synchrotron X-Ray Imaging for Nucleation...

Real Time Synchrotron X-Ray Imaging for Nucleation and Growth of Cu₆Sn₅ in Sn-7Cu-0.05Ni High Temperature Lead-Free Solder Alloys

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Abstract:

This paper demonstrates how recent progress for real-time solidification observation at SPring-8 synchrotron has contributed to the development of Sn-7wt%Cu-0.05wt%Ni high temperature lead-free solder alloys. Lead-free solder alloys in the composition range Sn-0.7 to 7.6wt%Cu that consist of primary Cu₆Sn₅ in a eutectic Sn-Cu₆Sn₅ matrix have been proposed as solders for application at temperatures up to 400°C for the assembly high current semiconductors. It is shown that trace levels of Al have a marked effect on the solder microstructure and refine the size of the primary Cu₆Sn₅. The solidification pathway that leads to the refinement was observed in real-time using X-ray synchrotron observations.

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Advanced Materials Engineering and Technology

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Periodical:

Advanced Materials Research (Volume 626)

Pages:

200-204

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.626.200

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Online since:

December 2012

Authors:

Kazuhiro Nogita, Hideyuki Yasuda, Stuart D. McDonald, Kentaro Uesugi

Keywords:

Cu₆Sn₅, Lead-Free Solder, Solidification, Synchrotron X-Ray Imaging

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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