Paper Title:
Joining of WC-Co to Ni by Direct Diffusion Bonding
  Abstract

Solid-state direct diffusion bonding between commercially pure nickel and tungsten carbide (with 6%Cobalt) has been carried out in the temperature of 980°C and 1100°C using different holding times in argon atmosphere. Samples were successfully joined without defects or cracks on the joining interface with the exception of the one joined at 980°C for 5 min. The results showed that joining occurred by the formation of a reaction zone. Scanning electron micrographs show that different intermediate layers are formed in the reaction zone, and the width of these layers increases with an increase in bonding temperature and time. Electron probe microanalysis revealed that at any particular bonding temperature, cobalt travel into the nickel side, whereas nickel travel comparatively larger distances in the tungsten carbide side.

  Info
Periodical
Edited by
S. Velumani and René Asomoza
Pages
127-132
DOI
10.4028/www.scientific.net/AMR.68.127
Citation
J. Lemus-Ruiz, A. L. Salas-Villaseñor, O. Flores, "Joining of WC-Co to Ni by Direct Diffusion Bonding", Advanced Materials Research, Vol. 68, pp. 127-132, 2009
Online since
April 2009
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Price
$35.00
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