An Experimental Study on Microwave Welding Technology of CuW to Cu Substrate

Xiao Wei Wang; Kai Yong Jiang; Ji Liang Zhang; Fei Wang; Jing Jing Zhang

doi:10.4028/www.scientific.net/AMR.703.79

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 703An Experimental Study on Microwave Welding...

An Experimental Study on Microwave Welding Technology of CuW to Cu Substrate

Abstract:

A preliminary study of welding CuW alloy to Cu substrate via microwave energy was investigated. Different proportions of CuW alloy powders were directly consolidated on clean Cu substrate surface. Then, they were heated at a certain temperature in a high vacuum microwave furnace. The results show that the appropriate conditions of 20°C/min heating rate, 900°C welding temperature and 5 minutes soaking time can weld CuW alloy to Cu substrate well, and the whole processing cycle is approximately 40 min. SEM morphologys reveal that the combination between CuW and Cu substrate is firm. The surface hardness of CuW alloy layer is 257HV, which is 2.5 times than that of Cu substrate. This technology reduces the processing cycle and has a positive significance on the surface modification and wear resistance of copper parts.