Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip

Yu Xin Koh; Sum Huan Ng; Khin Thet May; Cong Zhi Chan; Zhi Ping Wang

doi:10.4028/www.scientific.net/AMR.74.175

Paper Titles

Use of Micro Synthetic Jet Actuators for Boundary Layer Flow Control
p.157

Supernatant Decanting on a Centrifugal Platform
p.161

A Wideband Electromagnetic Energy Harvester for Random Vibration Sources
p.165

Nano-Photonic & Electronic Structures Pattern and Fabrication
p.171

Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip
p.175

Design and Fabrication of Novel Compliant Electrostatically Actuated Microvalves
p.179

Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel
p.183

Bandstop Filters with Comb-Like Electromagnetic Bandgap Structures on CPW Stubs
p.189

An On-Chip Micro-Droplet Optical Filter Using Evanescent Wave Coupling
p.193

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 74Manufacturing Issues and Considerations in Thermal...

Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip

Abstract:

The sealing of microchannels is a key step in the fabrication of microfluidic devices and thermal bonding is a common technique used. Here, major manufacturing issues and considerations in thermal bonding are investigated, including bonding quality and microchannel deformations. Flatness of substrate is extremely crucial to the uniformity in bonding. While increased bonding pressure helps to overcome problems related to surface topography and to enhance bond strength, its significant impact on geometrical changes of microchannel due to viscoelastic effect should also be taken into consideration.