Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip

Abstract:

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The sealing of microchannels is a key step in the fabrication of microfluidic devices and thermal bonding is a common technique used. Here, major manufacturing issues and considerations in thermal bonding are investigated, including bonding quality and microchannel deformations. Flatness of substrate is extremely crucial to the uniformity in bonding. While increased bonding pressure helps to overcome problems related to surface topography and to enhance bond strength, its significant impact on geometrical changes of microchannel due to viscoelastic effect should also be taken into consideration.

Info:

Periodical:

Edited by:

Selin Teo, A. Q. Liu, H. Li and B. Tarik

Pages:

175-178

DOI:

10.4028/www.scientific.net/AMR.74.175

Citation:

Y. X. Koh et al., "Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip", Advanced Materials Research, Vol. 74, pp. 175-178, 2009

Online since:

June 2009

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Price:

$35.00

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