Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel

Lu Jun Zhang; Andre Bossche

doi:10.4028/www.scientific.net/AMR.74.183

Paper Titles

A Wideband Electromagnetic Energy Harvester for Random Vibration Sources
p.165

Nano-Photonic & Electronic Structures Pattern and Fabrication
p.171

Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip
p.175

Design and Fabrication of Novel Compliant Electrostatically Actuated Microvalves
p.179

Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel
p.183

Bandstop Filters with Comb-Like Electromagnetic Bandgap Structures on CPW Stubs
p.189

An On-Chip Micro-Droplet Optical Filter Using Evanescent Wave Coupling
p.193

Numerical Simulation of Stretchable and Foldable Silicon Integrated Circuits
p.197

Design and Analysis of Micromixers on a Centrifugal Platform
p.203

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Fabrication of a Microfluidic Device with Insulated Electrodes on Top and Bottom Sides of the Channel

Abstract:

This paper presents a method to fabricate the microfluidic devices with insulated electrodes on top and bottom sides of the channel. To form the channel containing vertically opposing electrodes, two processed substrates were bonded together with an SU-8 intermediate layer sandwiched in between. An adhesive bonding technique, at wafer level, with accurate alignment was developed. Instead of using wafer bonder, the bonding was conducted on a hotplate, which relieves the requirement on the process equipment to a great extent.