Thermal Management and Alignment Strategies in MEMS Tunable Laser Packaging

Ji Fang Tao; Jonathan Tamil; Jian Wu; Kun Xu; Jin Tong Lin; Ai Qun Liu

doi:10.4028/www.scientific.net/AMR.74.319

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Transfer Technology of Ferroelectric Films onto the Polymer Substrate for the Application of High Density Capacitor
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Tunable Optical Filter by Thermal Effect Based on MEMS Technology
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Thermal Management and Alignment Strategies in MEMS Tunable Laser Packaging
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UV-Visible Spectra Character of Larger Diameter of Gold Nanoparticles (AuNPs)
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Numerical Modeling of Spiral Micro-Mixers
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A Liquid Optical Tip via Control of Flow Rate
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In/Ex-situ Detection of HBV DNA Using Dynamic Microcantilever
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 74Thermal Management and Alignment Strategies in...

Thermal Management and Alignment Strategies in MEMS Tunable Laser Packaging

Abstract:

A packaging architecture is developed for MEMS tunable laser (MEMS-TL). The hybrid integration of chips is realized under high accuracy thermal control and precise alignment. The thermal conductivity of the laser chip has been improved up to 60% by the proper substrate design of device and epi-down bonding method. Under the analysis of heat flux, we employ a thermo-electric cooler (TEC) to stabilize the temperature. The substrate is designed to accommodate gain chips with minimal active optical alignment, thus reducing the packaging cost. With this packaging scheme, the insertion loss is greatly induced less than 1 dB due to the advantages of horizontal and vertical alignment in optical fiber fastening and laser diode bonding.