Preparation and Performance of Silver Coated Copper Powder

Abstract:

Different parameters are used to characterize the conductivity of copper powder with silver plating. Ethanediamine（C2H8N2） is employed to adjust the pH value of plating solution (solution A), and chelate Cu2+ generated by side reaction, forming sound five-membered ring structure with Cu2+, thus preventing the formation of Cu(NH3)42+ which can avoid adsorption of Cu(NH3)42+ on the surface of copper powder. In this way silver-plated copper powder with conductivity equal to fine silver powder can be obtained, the effects of dosage of C2H8N2 and Tollens' reagent concentration on performance of silver-plated copper powder have also been investigated. The result shows that dosage of C2H8N2 has significant effects on electrical conductivity of silver-plated copper powder. The dosage of C2H8N2 should ensure that pH value of control solution A maintains 9.0~10.0. The concentration of Tollens' reagent should make sure that the generated silver-plated copper powder is most even and continuous and tightness when silver particles in form of heterogeneous nucleation is surrounded on the surface of copper powder, , and the optimum concentration is 0.09mol/L. The conductivity of silver-plated copper powder made by Tollens' reagent with 0.09mol/L concentration is optimal, which is 3.9×10-4Ω•cm,when adjusting the pH value of solution A to 9.5 by C2H8N2 control.

• Periodical: Advanced Materials Research (Volumes 750-752)
• Pages: 1057-1062
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.750-752.1057
• Online since: August 2013
• Authors: Hong Peng Sun, Kai Jun Wang, Xiao Lan Cai, Gang Yue, Ya Guang Chen
• Keywords: C₂H₈N₂, Chemical Plating, Electrical Conductivity, Silver-Coated Copper

References

[1] Zangru Ma, Introduction to Materials Science Function, p.21, Metallurgical Industry Press, Beijing, (1999) (In Chinese).

[2] Baoshun Zhang, Paint & Coatings Industry. 1, 31-36 (1996) (In Chinese).

[3] Deqiang Zhao, Libin Ma, Jun Yang. Electronic Components and Materials. 6, 54-56(In Chinese).

[4] Yuanxun Tang, Shuyuan Meng, Haibin Wu, Electronic Components and Materials. 9, 66-68 (2009) (In Chinese).

[5] E. Takeshima, K. Takatsu, Y. Kojima, T. Fujji, US Patent 235, 954 (1990).

[6] S. Djokic, M. Dubois, R. H. Lepard, US Patent 158, 945 (1999).

[7] T. Hayashi, US Patent 178(1993)909.

[8] X. R. Xu, X. J. Luo, H. R. Zhuang, W. L. Li, and B. L. Zhang, Mater. Lett. 57, 3987 (2003).

[9] M. Cazayous, C. Langlois, T. Oikawa, C. Ricolleau, A. Sacuto, Physical Review. B73, 113402–113405 (2006).

[10] Ohtani H., C.T. et al Progress in Surface[J], 1986. 23(2/3): l73.

[11] BaojiaoGao, Hongmei Jiang, Chinese Journal Of Inorganic Chemistry. 16 , 669-673 (2000) (In Chinese).

[12] Jielei Zhang, Preparation of Silver-coated Copper Powder Used in Electromagnetic Shielding Conductive Adhesives, 19-21, Kunming University of Science and Technology, Kunming (2006) (In Chinese).

[13] Victor K, Lamer, Robert et al. Journal of the American Chemical Society, 1950, 72(11): 4847-4854.