Recent Development of Focused Ion Beam System and Application

Abstract:

Ultra-precision machining is used for many engineering applications where the traditional processes fail to work. Focused ion beam (FIB) technology is a very important part of the ultra-precision machining. It can realize the precise positioning, microscopic observation and micro machining. This paper introduces the FIB system and its application. FIB system contains ion source, focusing and scanning equipment and sample station. FIB technique has many unique and important functions. It is widely used in semiconductor device fabrication and circuit failure analysis. It can realize sample etching, imaging, thin film deposited, ion implantation and micromachining.

• Periodical: Advanced Materials Research (Volumes 753-755)
• Pages: 2578-2581
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.753-755.2578
• Online since: August 2013
• Authors: Yan Chen, Li Bao An, Xiao Xia Yang
• Keywords: Application, FIB System, Precision Machining

References

[1] J.L. Yuan, B.H. Lv and F.H. Zhang: Journal of Mechanical Engineering Vol. 46 (2012), p.161.

[2] S.J. Zhang, Z.W. Xu, F.Z. Fang and X.T. Hu: Journal of Tianjin University Vol. 43 (2010), p.469.

[3] H.J. Yu, Y.M. Cui and R.M. Wang: Journal of Chinese Electron Microscopy Society Vol. 27 (2008), p.243.

[4] J.E.E. Baglin: Applied Surface Science Vol. 258 (2012), p.4103.

[5] X.G. Ma, T.J. Liu and W.Q. Gu: Micronanoelectronic Technology Vol. 6 (2007), p.328.

[6] D. Zheng: Modern Instruments and Medical Treatment Vol. 1 (2007), p.1.

[7] Y. Shang and H.Y. Zhao: Nuclear Physics Review Vol. 28 (2011), p.439.

[8] Z. Zhang: Nei Jiang Ke Ji Vol. 1 (2008), p.119.

[9] X.W. Yan and J.Y. Jia: Equipment for Electronic Products Manufacturing Vol. 188 (2010), p.14.

[10] M.Y. Ali and W. Hung: International Journal of Precision Engineering and Manufacturing Vol. 11 (2010), p.157.

[11] X. Chris, D. Annick and W. Annick: Metallurgical Analysis Vol. 32 (2012), p.7.

[12] H. Hosokawa, T. Nakajima, K. Shimojima and M. Mabuchi: Mater. Trans. Vol. 46 (2005), p.2295.

[13] J.C. Zhang, Y.J. Tang and W.D. Wu: Materials Review Vol. 20 (2006), p.40.

[14] C.J. Su, Z.Y. Zhou, X.Y. Ye and X.H. Wang: Micronanoelectronic technology Vol. 11 (2003), p.1.

[15] Z.W. Xu, F.Z. Fang, S.J. Zhang and Y.G. Chen: Journal of Chinese Electron Microscopy Society Vol. 28 (2009), p.62.

[16] S.J. Zhang, Z.W. Xu, F.Z. Fang and X.T. Hu: Journal of Tianjin University Vol. 43 (2010), p.469.

[17] C.A. Volkert and A.M. Minor: MRS Bull. Vol. 32 (2007), p.389.

[18] A.A. Tseng: J. Micromech. Microeng. Vol. 14 (2004), p.15.

[19] G. Lalev, S. Dimov, J. Kettle, F. van Delft and R. Minev: Special issue paper Vol. 222 (2008), p.67.

[20] X. Ding, D.L. Butler, G.C. Lim, C.K. Cheng, K.C. Shaw, K. Liu, W.S. Fong and H.Y. Zheng: J. Micromech. Microeng. Vol. 19 (2009), p.2.