Phase-Field Micro-Solidification Simulation for Dendrite Growth in Ni-Cu Binary Alloy

Wei Zhou Hou; Hong Kui Mao

doi:10.4028/www.scientific.net/AMR.830.3

Paper Titles

Preface and Committee

Phase-Field Micro-Solidification Simulation for Dendrite Growth in Ni-Cu Binary Alloy
p.3

Research in Non-Isothermal Crystallization Kinetics of LDPE and Inorganic Particle Composite Films
p.8

Wear Mechanisms Analysis of Material 20Cr2Ni4A
p.13

Wind Tunnel Test of Effect of Sound-Absorbing Material on Lift of Two-Element Airfoil
p.17

Preparation of Compound Clinoptilolite Filter Material and Performance of Ammonia Nitrogen Removal
p.24

Silicon Based Compound Filter Material Strengthening A/O Bio-Filter Denitrification Performance
p.28

Synthesis and Application of Manganese Oxide Based Nanomaterials
p.33

Study on the Giant Magnetostrictive Materials with Actuator Displacement Model Parameter Identification
p.37

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 830Phase-Field Micro-Solidification Simulation for...

Phase-Field Micro-Solidification Simulation for Dendrite Growth in Ni-Cu Binary Alloy

Abstract:

By optimizing the relevant dendrite growth parameters of Ni-Cu alloy undercooling melt, it has studied the effect that the dendrite evolution process of undercooled melt and the degree of undercooling melt have on the dendrite growth of undercooling melt. In the isothermal and non-isothermal solidification condition, relatively accurate result is obtained by applying the phase field method to simulate Ni-Cu alloy. Simulation results show non-isothermal simulation with Neuman boundary condition suit to the actual physical process better.

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Advanced Materials Research (Volume 830)

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3-7

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.830.3

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Online since:

October 2013

Authors:

Wei Zhou Hou, Hong Kui Mao

Keywords:

Dendrite Growth, Micro-Phase Field Simulation, Ni-Cu Alloy

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