Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer

Chun Ying Wang; Rui Zhang

doi:10.4028/www.scientific.net/AMR.873.837

Paper Titles

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Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 873Bond Mechanics and Failure Mode of Conductive...

Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer

Abstract:

In this paper, a novel conductive silver adhesive (ECA) for transducer is prepared to bond piezoelectric patch and the aluminum substrate. X-ray photoelectron spectroscopy (XPS) is used to study the fracture elements in order to analyze bond mechanics, fracture morphology is observation by scanning electron microscopy (SEM). The result of test and analysis shows ECA with sliane coupling agent have both physical and chemical bonding and the fracture type is cohesive failure. However the ECA without sliane coupling agent only has physical bonding and fracture type is mixed failure.

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Periodical:

Advanced Materials Research (Volume 873)

Pages:

837-844

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.873.837

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Online since:

December 2013

Authors:

Chun Ying Wang*, Rui Zhang

Keywords:

Bond Mechanics, Conductive Silver Adhesive (ECA), Failure Mode

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References

[1] R. Feng. Ultrasonics Handbook (Nanjing university press, Nanjing 1999).

Google Scholar

[2] A.N. Gent, G.R. Hamed. Encyclopedia of Polymer Science and Technology (John Wiley & Sons Inc, New York 1985).

Google Scholar

[3] J.E. Morris, S. Probsthain. Proceedings of the Fourth IEEE International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Espoo, Finland, 2000), pp.41-45.

Google Scholar

[4] S. Liong, C.P. Wong W.F., Burgoyne. IEEE Trans. Components Packag. 28(2005), No. 2, pp.327-336.

Google Scholar

[5] J.D. Venables. Journal of Materials Science. 19(1984), pp.2431-2453.

Google Scholar

[6] G.D. Davis, J.D. Venables. Durability of Structural Adhesive (Applied Science, UK 1983).

Google Scholar

[7] A. Nagai, K. Takemura, K. Isaka and I. Watanabe. Proceedings of the Second IEMT/IMC Symposium (Tokyo, Japan, 1998). pp.353-357.

Google Scholar

[8] I. Watanabe, T. Fujiyama, M. Arifuku, M. Fuji and Gotoh Y. Proceedings of Ninth IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (Atlanta, GA, 2004). pp.11-16.

Google Scholar

[9] G.Y. Li, Z.D. Li. Epoxy Adhesive and Application Technology (Chemical industry press, Beijing 2007).

Google Scholar