[1]
G. J. zhen, Y.H. Zhang, Y. Yuan, C. Wang, Reactive DC magnetron deposition of copper nitride films for write-once optical recording, Mater. Lett. 60 (2006) 3758-3760.
DOI: 10.1016/j.matlet.2006.03.107
Google Scholar
[2]
G.H. Yue, P.X. Yan, J.Z. Liu, M.X. Wang, M. Li, X.M. Yuan, Copper nitride thin film prepared by reactive radio- frequency magnetron sputtering, J. Appl. Phys. 98 (2005) 3506-3513.
DOI: 10.1063/1.2132507
Google Scholar
[3]
X.Y. Fan, Z.G. Wu, G.A. Zhang, C. Li, B.S. Geng, H.J. Li, P.X. Yan, Ti-doped copper nitride films deposited by cylindrical magnetron sputtering, J. Alloy Compd. 440 (2007) 254-258.
DOI: 10.1016/j.jallcom.2006.09.006
Google Scholar
[4]
M.G. Moreno-Armenta, A. Martinez-Ruiz, N. Takeuchi, Ab initio total energy calculations of copper nitride: the effect of lattice parameters and Cu content in the electronic properties, Solid State Sci. 6 (2004) 9-14.
DOI: 10.1016/j.solidstatesciences.2003.10.014
Google Scholar
[5]
M.G. Moreno-Armenta, W.L. Pe'rez, N. Takeuchi, First-principles calculations of the structural and electronic properties of Cu3MN compounds with M=Ni, Cu, Zn, Pd, Ag, and Cd, Solid State Sci. 9 (2007) 166-172.
DOI: 10.1016/j.solidstatesciences.2006.12.002
Google Scholar
[6]
F. Gulo, A. Simon, J. Kohler, R.K. Kremer, Li-Cu Exchange in Intercalated Cu3N-With a Remark on Cu4N, Agew. Chem. Int. Ed. 43 (2004) 2032-(2034).
DOI: 10.1002/anie.200353424
Google Scholar
[7]
U. Zachwiecha, H. Jacobs, Kupferpalladiumnitride, Cu3PdxN mit x=0. 020 und 0. 989 Perowskite mit bindender 3d10-4d10-Wechselwirkung, J. Less-Common Met. 170 (1991) 185-190.
DOI: 10.1016/0022-5088(91)90063-a
Google Scholar
[8]
J. Blucher, K. Bang, Prepararion of the Metastable Interstitial Copper Nitride, Cu4N by dc plasma Ion Nitriding, Mater. Sci. Eng. A117 (1989) L1-L3.
DOI: 10.1016/0921-5093(89)90110-x
Google Scholar
[9]
X.Y. Fan, Z.G. Wu, H.J. Li, B.S. Geng, C. Li, P.X. Yan, Morphology and thermal stability of Ti-doped copper nitride films, J. Phys. D: Appl. Phys. 40 (2007) 3430.
DOI: 10.1088/0022-3727/40/11/025
Google Scholar
[10]
J.F. Pierson, D. Horwat, Addition of silver in copper nitride films deposited by reactive magnetron sputtering, Scr. Mater. 58 (2008) 568-570.
DOI: 10.1016/j.scriptamat.2007.11.016
Google Scholar
[11]
X.Y. Cui, A. Soon, A.E. Phillips, et al. First principles study of 3d transition metal doped Cu3N, Journal of Magnetism and Magnetic Materials. 324(19)(2012) 3138–3143.
DOI: 10.1016/j.jmmm.2012.05.021
Google Scholar
[12]
XingAo Li, ZuLi Liu, ZuoBin Yuan, et al. Study on Cu-X-N (X= Al, Fe and La) films prepared by reactive magnetron sputtering, Nanoscience. 11(4) (2006) 276-280.
Google Scholar
[13]
J.F. Pierson, D. Horwat, Addition of silver in copper nitride films deposited by reactive magnetron sputtering, Scripta Materialia. 58(2008) 568-570.
DOI: 10.1016/j.scriptamat.2007.11.016
Google Scholar
[14]
Li Xing'ao, Liu Zuli, Zuo Anyou, et al. Properties of Al-doped Copper Nitride Films Prepared by Reactive Magnetron Sputtering, J. Wuhan University of Technology-Mater. Sci. Ed. 22(3)(2007) 446-449.
DOI: 10.1007/s11595-006-3446-y
Google Scholar
[15]
L. Gao, A.L. Ji, W.B. Zhang, et al. Insertion of Zn atoms into Cu3N lattice: Structural distortion and modification of electronic properties, Journal of Crystal Growth. 321(2011) 157-161.
DOI: 10.1016/j.jcrysgro.2011.02.030
Google Scholar