Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid

Naoki Hagiwara; Shinji Koyama; Ikuo Shohji

doi:10.4028/www.scientific.net/AMR.922.219

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Application of Texture Analysis for Optimizing Thermo-Mechanical Treatment of a High Mn TWIP Steel
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Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 922Cu/Cu Direct Bonding by Metal Salt Generation...

Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid

Abstract:

The effect of formic acid and citric acid surface modification on the bonded strength of the solid-state direct bonded interface of copper was investigated by SEM observations of interfacial microstructures and fractured surfaces. Copper surfaces were modified by boiling in 98% formic acid for 0.6 ks and 17% aqueous solution of citric acid for 0.96 s. Solid-state bonding was performed in a vacuum chamber at bonding temperature of 423 ~ 673 K under a pressure of 588 N (bonding time of 0.9 ks). As a result of surface modification by formic acid and citric acid, bonded joints were obtained at a bonding temperature 150 K (formic acid) and 100 K (citric acid) lower than that required for non-modified surfaces, and the bond strength was comparable to that of the maximum load.

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Periodical:

Advanced Materials Research (Volume 922)

Pages:

219-223

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.922.219

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Online since:

May 2014

Authors:

Naoki Hagiwara*, Shinji Koyama, Ikuo Shohji

Keywords:

Citric Acid, Copper, Formic Acid, Metal Salt, Solid-State Bonding

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References

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