Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid

Kota Matsubara; Shinji Koyama; Hideo Nagata; Yoshiyuki Suda; Ikuo Shohji

doi:10.4028/www.scientific.net/AMR.922.491

Paper Titles

Morphology of Edge Cracks of Rolled Magnesium Alloy Sheet
p.469

Effect of Composition and Thermo-Mechanical Processing on Microstructure Development in Ni-30Fe-Nb-C Model Alloys
p.475

Magnetic Pulse Spot Welding: An Innovative Approach
p.481

Effect of HPT on Age-Hardening Behavior in Cu-Added Excess Mg-Type Al-Mg-Si Alloys
p.487

Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid
p.491

High Tensile Ductility in Electrodeposited Bulk Nanocrystalline Ni–W Alloys
p.497

HRTEM Observation of Age-Precipitation in Mg-2.9at.% Alloys
p.503

Experimental and FEM Studies of the Relationships between Equal-Channel Angular Pressing Die Design, Strain Distribution and Pressing Forces
p.507

Surface Characterization of Magnesium Anodized in a 10M KOH Electrolyte
p.513

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 922Solid State Bonding of Al Alloy/SUS304 by Metal...

Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid

Abstract:

The effect of surface modification on the tensile strength of the bonded interface of Al alloy and SUS304 stainless steel was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 20 s and 99.7% Acetic acid for 60 s. Bonding was performed at bonding temperature of 753 ~ 813 K under a pressure of 6 MPa (bonding time of 1.8 ks). As a result of surface modification, bonded joints were obtained at a bonding temperature 20 K lower than that required for non-modified surfaces, and the bonded strength was comparable to that of the maximum load.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 922)

Pages:

491-496

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.922.491

Citation:

Cite this paper

Online since:

May 2014

Authors:

Kota Matsubara*, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda, Ikuo Shohji

Keywords:

Acetic Acid, Al Alloy, Metal Salt, Solid-State Bonding, SUS304

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] S. Koyama, S. K. Ting, I. Shohji, H. Hata, N. Hagiwara, K. Matsubara, A Study of State Bonding Strength of Al/Cu by Using Metal Salt Generation Bonding Method on Al Surface, Visual-JW2012, Proceedings. (2012) 167-168.

Google Scholar

[2] C. Clar, A. N. Scian, E. F. Aglietti, Synthesis and characterization of aluminum carboxylate gels, Thermochimica Acta. 407 (2003) 33-40.

DOI: 10.1016/s0040-6031(03)00265-x

Google Scholar

[3] Y. Liu, Z. F. Zhang, J. Halloran, R. M. Laine, Yttrium aluminum garnet fibers from metallo-organic precursors, J. Am. Ceram. Soc. 81 (1998) 629-645.

DOI: 10.1111/j.1151-2916.1998.tb02383.x

Google Scholar