Application of Using the Optical Strain Measuring Device in Material Testing and Tools and Dies Design

Article Preview

Abstract:

Optical strain analysis system plays an important role in tools and dies design, particularly in the phase of die design and die tryout. The objective of this paper is to present the information of the application by using the optical strain measurement device in tools and dies design and material testing. Therefore, two cases in mechanical testing and one case of tools and dies design are demonstrated. The AutoGrid® Compact strain measuring device is applied for all cases. The determination of Forming Limit Diagram (FLD) by using tensile testing machine and U-bending test supported by the optical strain measuring technique is performed and illustrated. In this paper, the procedure of material testing is developed and applied from related literatures. The result obtained from several cases shows the powerful performance of using the strain measurement device for providing the strain information in each situation of forming material as required so that the engineer can tackle the problem and find the solution to improve the production processes in a short time.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 931-932)

Pages:

317-321

Citation:

Online since:

May 2014

Authors:

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] W.F. Hosford, R.M. Caddell, Metal forming mechanic and metallurgy 3rd edition, Cambridge, UK, (2007).

Google Scholar

[2] W. Bleck, Material characterization 2nd edition, RWTH Aachen University, Germany, (2010).

Google Scholar

[3] American Society for Testing and Materials, Standard Test Method for Determining Forming Limit Curves, U.S. (2008).

Google Scholar

[4] K. Narasimhan, M.P. Miles and R.H. Wagoner, A better sheet-formability test, Materials Processing Technology, vol. 50, 1995, pp.385-394.

DOI: 10.1016/0924-0136(94)01400-u

Google Scholar