For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Committees
Preface
Blade Diamond Disk for Conditioning CMP Polishing Pad
p.3
Three-Point Bending Test Behaviour of a QFN Semiconductor Package
p.7
Structural and Optical Properties of Dy Doped ZnO Film Grown by RF Magnetic Sputter
p.11
The Progress of Fixed Abrasive Wire Saws in the Last Decade
p.15
Photocatalytic Analysis and Characterization of Zn2SnO4 Nanoparticles Synthesized via Hydrothermal Method with Na2CO3 Mineralizer
p.19
An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging
p.23
The Crystal Structural Properties of Sputtered ZnO Films Containing Internal Stress
p.28

Blade Diamond Disk for Conditioning CMP Polishing Pad

Article Preview

Abstract:

A diamond conditioner or dresser is needed to regenerate the asperity structure of the pad and recover its designed ability in chemical mechanical polishing (CMP) process. In this paper a new design of diamond conditioner is made by shaping a sintered matrix of polycrystalline diamond (PCD) to form teethed blades. These blades are arranged and embedded in epoxy resin to make a designed penetration angle, called the blade diamond disk. The dressing characteristics of pad surface textures are studied by comparison with conventional diamond conditioner. It is found that the height variation of the diamond tip of blade diamond disk is significantly smaller than the conventional diamond disk. The dressing rate of blade diamond disk is lower than that of the conventional diamond disk, and hence the pad life is prolonged. As a result, reduction of the cost CMP is expected. In addition the pad surface roughness Ra of about 3.79μm is less than Ra of about 4.15μm obtained after dressing using a conventional diamond disk.

You might also be interested in these eBooks
Manufacturing Science and Engineering I View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 97-101)

Pages:

3-6

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.97-101.3

Citation:

Cite this paper

Online since:

March 2010

Authors:

Ming Yi Tsai

Keywords:

Chemical Mechanical Polishing (CMP), Diamond Conditioner, Polyurethane Pad

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2010 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann: Chemical Mechanical Planarization of Microelectronic Materials (John Wiley & Sons, NY 1997).

DOI: 10.1002/9783527617746

Google Scholar

[2] D. Stein, D. Hetherington, M. Dugger, and T. Stout: J. of Electron. Mater. Vol. 25 (1996), p.1623~1627.

Google Scholar

[3] C. M. Sung, Y. L. Pai: Advances in Abrasive Technology Ⅲ, pp.189-196. (2000).

Google Scholar

[4] M. Y. Tsai, S. T. Chen, Y. S. Liao and J. Sung: International Journal of Machine Tools and Manufacture, Vol. 49 (2009), pp.722-729.

Google Scholar

[5] T. Fujita, M. Ishikura, N. Kawai, O. Kinoshita, and Y. Morioka: CMP-MIC Conf. (Santa Clara, CA 2005), pp.452-459.

Google Scholar

[6] A. S. Lawing: CMP-MIC Conf. (Santa Clara, CA 2005), pp.33-42.

Google Scholar

[7] Y. S. Liao, M. Y. Tsai, J. C. Sung: Key Engineering Mater. Vol. 329 (2007), pp.151-156.

Google Scholar

[8] S. M. Song, C. M. Sung, C. C. Hu, Y. L. Pai, M. Y. Tsai, Y. S. Liao: VLSI Multilevel Interconnection Conf. (Hawaii, USA 2004) pp.255-260.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.