The Progress of Fixed Abrasive Wire Saws in the Last Decade

Abstract:

Diamond wire saw is the leading technology for use in slicing hard brittle material. This paper provides a brief review of its research progress in the most recent years. According to the bonding material kinds of diamond wire saw, it can be classified into three main categories, i.e. metallic bonding materials, organic bonding materials, and resin bonding materials. In the past decade, several new major technical developments in fixed abrasive diamond wire saw have emerged. This paper investigates the related literature on four different types of fixed abrasive diamond wire saws, presents their manufacturing processes and machining performance, and compares the tension and anti-abrasion of the wire saws, removal efficiency of slicing, and their applications in silicon slicing.

• Periodical: Advanced Materials Research (Volumes 97-101)
• Pages: 15-18
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.97-101.15
• Online since: March 2010
• Authors: Chun Yan Yao, Ming Huan Wang, Wei Peng
• Keywords: Bonding Material, Diamond Wire Saw, Fixed-Abrasive, Review

References

[1] C. Hardin, J. Qu, A. J. Shih: Materials and Manufacturing Processes, Vol. 19(2004), pp.355-359.

[2] U.S. Patent Pub. No: US2002/0100469 A1. (2002).

[3] H.K. Tonshoff，H. Hillma: Diamond and Related Materials，Vol. 11(2002), pp.742-745.

[4] J. Sugawara, H. Hara, A. Mizoguchi: SEI Technical Review, Vol. 58(2004), pp.7-11.

[5] Sung Chien-min: United States, 6915796. (2005).

[6] Xia ben junzhi: Jewelry Science and Technology, Vol. 16(2004), pp.56-61.

[7] K. Furutani, Y. Murase . The 41st CIRP Conference on Manufacturing Systems 2008, Japan.

[8] W. Peng, F.Q. Liu: Institution of Engineering and Technology, Vol. 524(2006) pp.2347-2350.

[9] W. Peng, T. Gao, C. Y. Yao: Key Engineering Materials, Vol. 304-305(2006), pp.71-75.

[10] F.Q. Liu, C.Y. Yao, W. Peng: Advanced Materials Research, V0l. 24-25(2007), pp.289-294.

[11] W.I. Clark, A.J. Shih, C.W. Hardin, R.L. Lemaster, S.B. McSpadden: International Journal of Machine Tools and Manufacture, Vol. 43(2003), pp.523-532.

DOI: 10.1016/s0890-6955(02)00215-8

[12] W.I. Clark, A.J. Shih, R.L. Lemaster, S.B. McSpadden: International Journal of Machine Tools and Manufacture, Vol. 43(2003), pp.533-542.

DOI: 10.1016/s0890-6955(02)00216-x

[13] P Q Ge, L Zhang, W Gao, Z C Liu. Journal: Materials Science Forum, Vols. 471-472(2004), pp.481-484.

[14] K. Furutani, M. Kanai, Y. Mieda, M. Suzuki: Proceedings of AMPT (2006), Las Vegas, USA.

[15] K. Furutani, H. Sunada: International Journal of Electronic and Machine, Vol. 9(2004), pp.15-20.

[16] Y. Chiba, Y. Tani, H. Sato: CIRP Annals Manufacturing Technology, Vol. 52(2003), pp.281-284.

[17] E. C. Leea，J. W. Choi: Surface Coat Technology，V0l. 148(2001)，pp.234-237.

[18] John B. Hodsden, Jeffrey B. Hodsden: US Patent Number 6065462. (2000).

[19] J. B. Hodsden: US Patent Number 6, 279, 564. (2001).

[20] T. Enomoto, Y. Shimazaki, Y. Tani, Y. Kanda: Annls of the CIRP, Vol. 48 (1999) , pp.273-276.

[21] T. Enomoto, Y. Tani, T. Tetsuhiro: Journal of the Japan Society for Precision Engineering Vol. 68(2002), pp.1481-1485.

[22] C.Y. Yao, W. Peng, M. H Wang: Advannced Material Research, 2009. 5 Vols. 69-70, pp.328-332.

[23] F. Liu, W. Peng, C.Y. Yao: International Journal of Computer Applications in Technology, Vol. 29(2007), pp.155-158.