Temperature Monitoring on Microwave Curing of DGEBA E-51 and 4,4’DDM System

Ren Li Ma; Xin Long Chang; Bing Long

doi:10.4028/www.scientific.net/AMR.998-999.103

Paper Titles

Research on Electrical Characteristics of Metal Rubber
p.87

Study on the Carbon Doping of Sugar Added MgB₂ Superconductors Prepared by Low Temperature Sintering
p.91

Synthesis and Self-Assembly Study of Biodegradable Amphiphilic Triblock Copolymers with PEG Block
p.95

Synthesis, Photophysical Properties and Photoinduced Intermolecular Electron Transfer of a Novel Aryl Benzyl Ester Dendritic Axially Substituted Silicon (IV) Phthalocyanine
p.99

Temperature Monitoring on Microwave Curing of DGEBA E-51 and 4,4’DDM System
p.103

The BPG Property of Photonic Crystal for TE Mode with Sector Pillars as Scatterers
p.107

The Fabrication of Nanometer- and Micrometer-Sized Silica Hollow Spheres
p.111

The Investigation of Microstructure Silicon NH₃ Gas Sensors Based on Polyaniline Nano-Thin Films
p.115

The Structure and Electrical Property of sp² Rich Carbon Films by Magnetron Sputtering
p.120

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Temperature Monitoring on Microwave Curing of DGEBA E-51 and 4,4’DDM System

Abstract:

Temperature monitoring was done on microwave curing of epoxy resin system consisting of di-glycidyl ether of bisphenol-A(DGEBA) E-51 and curing agent 4,4’diamino-diphenyl-methane (DDM). The study shows that microwave curing of epoxy resin system is an exothermic reaction and the temperature variation during microwave processing has the obvious characteristics of “temperature increment - heat release - temperature falling”. Analysis on the infrared thermal images indicates that each moulding body has its own temperature distribution and differs from others. The non-uniform temperature distribution reveals the uneven electric field distribution in the domestic microwave oven.