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Stress Assessment in a TPU Disk under Diametral Compression Relying on Strain Measurements by Localized Spectrum Analysis

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Abstract:

This study investigates the assessment of stresses in a Thermoplastic Polyurethane (TPU) disk under diametral compression relying on full-field strain measurements by Localized Spectrum Analysis (LSA). A checkerboard pattern was first laser-engraved on the disk surface. The LSA processing of the checkerboard images captured in the undeformed (reference state) and deformed (at –8 kN) configurations allowed the determination of the two in-plane principal stretch ratios and the corresponding principal directions. An incompressible behavior was assumed to derive the out-of-plane stretch ratio. Using a neo-Hookean constitutive model, the maps of the Cauchy stress tensors and the First Piola-Kirchhoff stress tensors were deduced. This study demonstrates the potential of the LSA strain measurement technique for deriving stress maps in soft materials, which will be used in future work to feed into the Virtual Fields Method (VFM) for identifying interparticle contact forces in soft granular systems.

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Periodical:

Advances in Science and Technology (Volume 175)

Pages:

121-126

DOI:

https://doi.org/10.4028/p-8pGj0l

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Online since:

May 2026

Authors:

Kunanon Jongchansitto*, Thomas Dumontier, Xavier Balandraud, Pawarut Jongchansitto, Itthichai Preechawuttipong, Thomas Jailin, Jean Benoît Le Cam, Fabienne Blanchet

Keywords:

Cauchy Stress, First Piola-Kirchhoff Stress, Full-Field Strain Measurement, Granular Material, LSA, Soft Particle, Thermoplastic Polyurethane

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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