[1]
W. Olesińska, D. Kaliński, M. Chmielewski, R. Diduszko, W. Włosiński, Influence of titanium on the formation of a barrier, layer during joining an AlN ceramic with copper by the CDB technique, Journal of Materials Science: Materials in Electronics, 17(10) (2006).
DOI: 10.1007/s10854-006-0024-1
Google Scholar
[2]
M. Barlak, J. Piekoszewski, J. Stanislawski, Z. Werner, K. Borkowska, M. Chmielewski, B. Sartowska, M. Miskiewicz, W. Starosta L. Walis, J. Jagielski, The effect of intense plasma pulse pre-treatment on wettabillity in ceramic–copper system, Fusion Engineering and Design, 82 (2007).
DOI: 10.1016/j.fusengdes.2007.08.010
Google Scholar
[3]
M. Chmielewski, W. Weglewski, Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials, Bulletin of the Polish Academy of Sciences - Technical Sciences, 61(2) (2013) 507-514.
DOI: 10.2478/bpasts-2013-0050
Google Scholar
[4]
K. Hanada, K. Matsuzaki, T. Sano, Thermal properties of diamond particle-dispersed Cu composites, Jornal of Materials Processing Technology, 153-154 (2004) 514-518.
DOI: 10.1016/j.jmatprotec.2004.04.289
Google Scholar
[5]
S.F. Moustafa, S.A. El-Badry, A.M. Sanad, B. Kieback, Friction and wear of copper–graphite composites made with Cu-coated and uncoated graphite powders, Wear, 253 (2002) 699-710.
DOI: 10.1016/s0043-1648(02)00038-8
Google Scholar
[6]
Xu Jincheng, Yu Hui, Xiaolong, Li Xiaolong, Yang Hua, Effects of some factors on the tribological properties of the short carbon fiber-reinforced copper composite, Materials and Design, 25 (2004) 489-493.
DOI: 10.1016/j.matdes.2004.01.011
Google Scholar
[7]
J. Kovacik, S. Emmer, J. Bielek, L. Kelesi, Effect of composition on friction coefficient of Cu–graphite composites, Wear, 265 (2008) 417-421.
DOI: 10.1016/j.wear.2007.11.012
Google Scholar
[8]
J. Korab, P. Stefanik, S. Kavecky, P. Sebo, G. Korb, Thermal conductivity of unidirectional copper matrix carbon fibre composites, Composites Part A, 33 (2002) 577-581.
DOI: 10.1016/s1359-835x(02)00003-9
Google Scholar
[9]
Younghwan Jang, Sangshik Kim, Sangkwan Lee, Doohyun Kim, Moonkwang Um, Fabrication of carbon nano-sized fiber reinforced copper composite using liquid infiltration process, Composites Science and Technology 65 (2005) 781-784.
DOI: 10.1016/j.compscitech.2004.10.018
Google Scholar
[10]
Y. Pauleau, F. Thiery, Nanostructured copper–carbon composite thin films produced by sputter deposition/microwave plasma-enhanced chemical vapor deposition dual process, Materials Letters, 56 (2002) 1053-1058.
DOI: 10.1016/s0167-577x(02)00676-6
Google Scholar