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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 237-240Diffusion of Si in Ti3Al Intermetallic Compound

Diffusion of Si in Ti₃Al Intermetallic Compound

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Diffusion in Materials - DIMAT2004

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Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Pages:

334-339

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.237-240.334

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Online since:

April 2005

Authors:

Yuichiro Koizumi, Yohei Sakakibara, Yoritoshi Minamino, Nobuhiro Tsuji

Keywords:

Activation Energy, Anti-Site Atom, D0₁₉ Structure, Ordered Alloy, Silicon, Vacancy

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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