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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 367Effect of Interfacial Heat Transfer Coefficient on...

Effect of Interfacial Heat Transfer Coefficient on Dendritic Growth and Microhardness during Horizontal Directional Solidification of an Aluminum-Copper Alloy

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Abstract:

This paper presents a theoretical-experimental study for the prediction of the interfacial heat transfer coefficient during the horizontal directional solidification of an Al-3wt.%Cu alloy on water cooled stainless steel chill under transient heat flow conditions. Eight thermocouples were connected with the casting and the time-temperature data were recorded automatically. The thermocouples were placed at 5, 10, 15, 20, 30, 50, 70 and 90 mm from the metal-mold interface. A numerical technique which compares theoretical and experimental thermal profiles was used to measure the heat transfer coefficient values. This has permitted the evaluation of the variation of this thermal parameter along the solidification which is represented by a power equation that shows the time dependence during the process given by h_i = constant (t)^-n, which represents the best fit between the experimental and calculated curves. The obtained results also include the variation of both primary and secondary dendritic arm spacings of alloy analyzed as a function of heat transfer coefficient. These dendrite arm spacings were found to decrease as the values of this coefficient are increased. Finally, an experimental law of the Hall-Petch type is proposed relating the resulting microhardness to the heat transfer coefficient investigated.

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Defect and Diffusion Forum (Volume 367)

Pages:

10-17

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.367.10

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Online since:

April 2016

Authors:

A.S. Barros, Adrina P. Silva, Ivaldo Leão Ferreira, O.L. Rocha, A.L. Moreira

Keywords:

Computer Modeling, Dendritic Spacing, Heat Transfer Coefficient, Microhardness, Solidification

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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