Defect and Diffusion Forum Vol. 426

Abstract: A whole wafer method for industrial high volume, non-destructive characterizing of extended defects is demonstrated for 150 mm and 200 mm 4H-SiC wafers. Deep learning (DL) coupled with non-destructive techniques (NDT, DL-NDT) involving high volume, fast optical microscopy methods correlates industry accepted chemistry and physics-based etch and diffraction techniques for defect characterization. The application of the DL-NDT method is shown to reproduce defect distributions achieved by accepted etch techniques for extended defects of threading dislocations (TD), basal plane dislocations (BPD), and threading screw dislocations (TSD). An example of algorithm development is described to show progress toward implementing the method, as well as DL-NDT defect density compared to etch density for multiple wafers. The development status for implementing this technique for large-scale industrial wafer production includes etch validation of the results to ensure the technique is consistent and reliable. The ability to use this non-destructive technique ultimately will result in better correlation with device behavior and provide feedback to crystal growth processes to improve substrate wafers, while reducing the need for etch methods.

Abstract: The quality of the silicon carbide (SiC) epitaxial layer, i.e., layer homogeneities and extended defect densities, is of highest importance for high power 4H-SiC trench metal-oxide-semiconductor field effect transistors (Trench-MOSFET) devices. Especially, yield for devices with a large chip area is severely impacted by extended defects. Previously, devices had to be fully manufactured to effectively gauge the impact of a reduction in extended defect densities in the epitaxial layers on device yield. The production of devices such as Trench-MOSFETs is an extensive procedure. Therefore, a correlation between extended defects in the epitaxial layer and electrical device failure would allow to reliably estimate the impact of process changes during epitaxial layer deposition on electrical device yield.For this reason, n-type epitaxial layers were grown on around 1,000 commercially available 150 mm 4H-SiC Si-face substrates, which received a chemical wet cleaning prior to the epitaxy deposition. Substrates with lowest micro-pipe density from two different suppliers were used. The wafers were characterized with the corresponding device layout for defects utilizing surface microscopy as well as ultraviolet photoluminescence techniques. Subsequently, these wafers were used to produce more than 500,000 Trench-MOSFET devices. All devices have been tested on wafer level for their initial electrical integrity.With these methods a precise correlation between extended defects in the epitaxial layer and electrical failures on wafer level could be found. The influence of different substrates on the defect-based yield prediction regarding the electrical yield on wafer level is discussed. Additionally, a calculated kill-ratio is presented and the severity of defect classes on initial device failure, e.g., stacking faults, and their key failures modes are discussed.

Abstract: We present a detailed study of the behavior of the photoluminescence (PL) of the TS color center in 4H-SiC under controlled mechanical strain. We have investigated the TS1 line under varying strain, including its reaction to compression and tension. We use emission polarization measurements to gain access to the orientation of the underlying defects. We put our results in context with previous findings and find good agreement, corroborating the proposed microscopic model.

Abstract: This work presents the characterization of minority carrier traps in epitaxial n-type 4H-SiC after high fluence neutron irradiation using minority carrier transient spectroscopy (MCTS) in a temperature range of 20 K to 660 K. Three minority carrier trap levels are reported, labelled as X, B and Y, whose activation energies were estimated by Arrhenius analysis and where the B level is assigned to substitutional boron (B_Si). The dynamic behaviour of the trap levels was studied by consecutive temperature scans.

Abstract: Intense efforts are currently in progress to study various sources of basal plane dislocations (BPDs) in SiC epitaxial layers. BPDs can generate Shockley-type stacking faults (SSFs) in SiC epitaxial layers, which have been shown to be associated with the degradation of power devices. This study shows that the star-shaped defect can be a source of several BPDs in the epitaxial layer. We investigate the complex microstructure of the star defect, the generation of BPDs, and expansion of SSFs using various complementary microscopy and optical techniques. We show direct evidence that star-defects can be a nucleation point of single-SSFs that can expand at the core of the defect. Newly found secondary dislocation arrays extending over a few centimeters away are found to be emanating from the primary arms of the star defect. The presence of such dislocation walls and the expansion of single-SSFs will affect the yield of numerous die on a wafer. Further understanding of the formation mechanism of stacking faults generated from star-defects as provided in this study helps understand their effect on SiC-based devices, which is crucial to assess device reliability.

Abstract: We have investigated the p-dopant potential of 14 different impurities (Be, B, F, Mg, Al,Ca, Sc, Cu, Zn, Ga, In, Ba, Pt, and Tl) within 4H-SiC via Density Functional Theory (DFT) calcu-lations using a hybrid density functional. We analyse the incorporation energies of impurity atomson Si and C sites as well as the character of lattice distortion induced by impurities. The calculatedthermal ionization energies confirm that Al and Ga on the Si site are the best candidates for p-dopingof 4H-SiC. Although we find some correlation of incorporation energies with atomic radii of impuri-ties, the difference in chemical interaction with neighbouring atoms and strong lattice distortions playimportant roles in determining the impurity incorporation energies and charge transition levels. Wefind Al to still be the best and most industrially viable p-dopant for 4H-SiC.

Abstract: The TS center is a promising temperature-stable photoluminescence center in 4H SiC. Here we investigate the carbon di-vacancy-antisite complex inthe framework of ab initio theory as a tentative model for the TS center. We identify optical transitionsof the basal complexes with the TS lines based on excitation energies, Stark shifts, and radiative char acteristics. Charge-state-control of the TS center in p- and n-type Schottky contacts is demonstrated. Our experimental findings are consistent with the positively charged complex.

Abstract: A novel high energy implantation system has been successfully developed to fabricate 4H-SiC superjunction devices for medium and high voltages via implantation of dopant atoms with multi-energy ranging from 13 to 66 MeV to depths up to 12um. Since the level of energies used is significantly higher than those employed for conventional implantation, lattice damage caused by such implantation must be characterized in detail to enhance the understanding of the nature of the damage. In regard to this, by employing the novel high energy system, 4H-SiC wafers with 12μm thick epilayers were blanket implanted by Al atoms at energies ranging from 13.8MeV to 65.7MeV and N atoms at energies ranging up to 42.99MeV. The lattice damages induced by the implantation were primarily characterized by Synchrotron X-ray Plane Wave Topography (SXPWT). 0008 topographs recorded from the samples are characterized by an intensity profile consisting of multiple asymmetric diffraction peaks with an angular separation of only 2” (arcseconds). Using Rocking-curve Analysis by Dynamical Simulation (RADS) program, diffracted intensity profile was used to extract the corresponding strain profile indicating an inhomogeneous strain distribution across the depth of the implanted layer.

Abstract: In 4H-SiC crystals, Frank type dislocations are created through the deflection of threading screw/mixed dislocations onto the basal plane. Grazing-incidence X-ray topographs are often used to evaluate the density of such dislocations and a knowledge of the effective penetration depth is therefore essential. In this study, a systematic analysis is performed to investigate the effective penetration depth, which is the depth from which contrast from the dislocation is still discernible. This is achieved by comparison between observed topographic images and detailed ray tracing simulations. Simulations shows no significant contrast difference between a deflected TSD and a deflected TMD with the same line direction since the large c component is the dominant contributor to the effective misorientation, whereas the effect of a component is rather negligible. Therefore, this effective penetration depth study uses ray tracing simulation images of deflected TSDs with photoelectric absorption applied to compare with all topographically observed Frank type dislocations. Analysis first reveals that the effective penetration depth varies with the line direction of a Frank type dislocation, and the effective penetration depth is significantly deeper compared to that of a BPD. Further, the effective penetration depth on ray tracing simulations with absorption applied matches well with experimentally measured depth. The study also evaluated the effectiveness of a simplified model based on an approximate expression for the effective misorientation of a dislocation modulated by photoelectric absorption. This was also found to yield satisfactory results and can be used as a universal method to determine the effective penetration depth for Frank type dislocations with c component of Burgers vector.