GNPs Reinforced Epoxy Nanocomposites Used as Thermal Interface Materials

Abstract:

The current tendency in electronics is the reduction of size while continuously increasing the power consumption due to new functionalities and applications. Both aspects generate a heat increment. Consequently, dissipating the heat to the environment is necessary in order to avoid component overheating. [1,2]. The most efficient way to achieve it is to allow the heat to flow from the hot component to a heat sink. In order to improve the efficiency of this process, thermal resistance between both components must be reduced which is usually done by using a thermal interface material (TIM) between both surfaces [3-5]. This material should fill the gaps created due to the microscopic roughness of both surfaces and it must have good thermal conductivity [6]. These air filled gaps result in a very high contact resistance between joined parts, as the air thermal conductivity is very low [7].

• Periodical: Journal of Nano Research (Volume 38)
• Pages: 18-25
• DOI: https://doi.org/10.4028/www.scientific.net/JNanoR.38.18
• Online since: January 2016
• Authors: Alberto Jiménez-Suárez, R. Moriche, S.G. Prolongo, M. Sánchez, A. Ureña
• Keywords: Epoxy Resin, Graphene Nanoplatelets (GNPs), Thermal Interface Materials (TIMs), Thermal Properties

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