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Effect of Thermal Cycle Profile on Thermal Fatigue Life of Sn-3.0Ag-0.5Cu Solder Joints for Wafer-Level Chip Scale Package

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Abstract:

Thermal cycling tests were conducted on solder joints of wafer-level chip scale packages with Sn-3.0Ag-0.5Cu (mass%) to investigate the effect of difference in the thermal cycle profile on the thermal fatigue properties. The tests were conducted using three different types of chambers and the temperature range was-40°C to 125°C. The result showed that the thermal fatigue life tends to be shorter when the temperature change rate in the thermal cycle profile is slow. This means that the effect of creep on thermal fatigue life is large. The analogous analysis result was obtained by finite element analysis. The microstructural analysis of damaged joints revealed that recrystallized grains form in the solder and crack progresses at their grain boundaries. Thus the thermal fatigue life was suggested to be dominated by the ease of formation of recrystallized grains in solder.

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Periodical:

Key Engineering Materials (Volume 1040)

Pages:

55-61

DOI:

https://doi.org/10.4028/p-3bL2iT

Citation:

Cite this paper

Online since:

January 2026

Authors:

Shun Sakagami*, Kenta Kawaguchi, Tatsuya Kobayashi, Ikuo Shohji, Fumiya Funatomi, Kyohei Ohashi, Ryuki Sakai

Keywords:

Crystal Orientation Analysis, Finite Element Analysis, Lead-Free Solder, Sn-3.0Ag-0.5Cu, Thermal Cycle Profile, Thermal Fatigue Behavior

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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