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Degradation Behaviour of Sn-Ag-Cu Lead-Free Solder Joint with Electrolytic Ni Plated Electrode due to Electromigration

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Abstract:

The effect of electrolytic Ni plating on the Cu electrode on electromigration in the Sn-3.0Ag-0.5Cu (mass%) solder joint was investigated. The energization test was conducted using Ni-plated Cu/Sn-3.0Ag-0.5Cu/Ni-plated Cu joints. For comparison, the same test was done using joints without Ni plating. The scalloped Cu6Sn5 layer formed at the joint interface without Ni plating. In the joint with Ni plating, granular (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 formed at the joint interface on the solder side and on the Ni side, respectively. Crack propagation was observed on the cathode side in both joints by current load. Crack propagated at the Cu6Sn5/solder interface in the joint without Ni plating and at the (Cu,Ni)6Sn5/solder interface in the joint with Ni plating, respectively. The Ni plated layer inhibited the diffusion of Cu facilitated by current load so that the growth of the reaction layer on the anode side was also inhibited. Therefore, the Ni plating is expected to improve the EM life.

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Periodical:

Key Engineering Materials (Volume 1040)

Pages:

63-68

DOI:

https://doi.org/10.4028/p-2dygjX

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Online since:

January 2026

Authors:

Kenta Kawaguchi*, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Keishi Nakamura, Koichi Hirasawa, Hitoshi Amemiya

Keywords:

Electromigration, Ni Electrolytic Plating, Sn-Ag-Cu Solder, Solder Joint

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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