Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line

Abstract:

Electromigration is one of the main damage mechanisms of interconnecting metal lines. Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD* gen, was formulated, and a prediction method for electromigration failure in passivated polycrystalline line was developed using AFD* gen. This method requires only the film characteristics of the metal line and the application is not limited by a line shape and operating condition. The usefulness of the method has been shown using the straight-shaped lines. Using the ymmetrically and asymmetrically angled lines experiments are performed, and the line-shape dependency of the lifetime obtained by the prediction method is verified comparing with the results obtained from the experiment.

• Periodical: Key Engineering Materials (Volumes 297-300)
• Pages: 263-268
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.297-300.263
• Online since: November 2005
• Authors: S. Uno, Masuyuki Hasegawa, K. Sasagawa, Masumi Saka
• Keywords: Angled Polycrystalline Line, Electromigration, Failure, Governing Parameter, Lifetime, Prediction Methods

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