Real-Time and Full-Field Deflection Measurement of Thin Films Electroplated on the Single Crystal Silicon Wafers

Abstract:

A special speckle microinterferometer has been developed to test the mechanical properties of thin films electroplated on the single crystal silicon wafer. A piezo-actuated micro-loading unit is synchronized with the microinterfermeter to measure thin film deflection in bending with an accuracy of sub-micrometers. All of the film specimens were microfabricated to be the type of microbridge samples. They are made of Cu and NiFe, the sizes from 1102.9µm to 213.7µm long, 491.0µm to 9.7µm wide. The corresponding thicknesses are 9.4µm and 7.6µm, respectively. Deflections of the microbradge samples can be measured full-field and real-time by using the microinterferometer and no patterning or marking of the specimen surface is needed. The loading force is directly measured using a miniature load cell. The Young’s moduli are calculated for both material and sample size from the load-deflection curves. Test techniques, procedures and factors which affect on the deflection measurements are briefly presented along with detailed analyzes of the results.

• Periodical: Key Engineering Materials (Volumes 306-308)
• Pages: 1289-1294
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.306-308.1289
• Online since: March 2006
• Authors: Xi De Li, Cheng Wei
• Keywords: Bending Tests, Mechanical Property, Microbridge, Micro-Electromechanical System (MEMS), Speckle Microinterferometer, Thin Film

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