A Suspending Abrasives and Porous Pad Model for the Analysis of Lubrication in Chemical Mechanical Polishing

Abstract:

The lubrication properties of the slurry between the silicon wafer and the pad in chemical mechanical polishing (CMP) are critical to the planarity of the silicon wafer. The effects of porous pad and suspending abrasives on the slurry film beneath the wafer become more prominent as the size of the silicon wafer becomes bigger. In order to explore the effects of porous pad and suspending abrasives on the lubrication properties of the slurry, a three-dimensional lubrication model based on the micropolar fluid theory and Darcy’s law is developed. The effects of the nanometer abrasives and the porosity of the pad on the lubrication of the slurry film between the silicon wafer and the pad are discussed.

• Periodical: Key Engineering Materials (Volumes 315-316)
• Pages: 775-778
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.315-316.775
• Online since: July 2006
• Authors: J.Y. Liu, Dong Ming Guo, Zhu Ji Jin, Ren Ke Kang
• Keywords: CMP, Porous Pad, Suspending Abrasive

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