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A Study on Deformation and Removal Mechanisms of Tungsten Carbide Using Nanoindentation

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Abstract:

Nanoindentation was used to study the deformation and removal mechanisms of cemented tungsten carbide. It was found that the microstructure of the material has significant influences on its mechanical properties, which determines the critical conditions for damage-free nanogrinding. The results also indicated that when material removal events occur at nanometric scale, such influences should be taken into account for gaining the full potential of nanogrinding.

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Periodical:

Key Engineering Materials (Volume 329)

Pages:

385-390

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.329.385

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Online since:

January 2007

Authors:

Han Huang, Rudy Irwan, Tsunemoto Kuriyagawa

Keywords:

Deformation, Microstructure, Nanoindentation, Removal, Tungsten Carbide

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] H. Suzuki, T. Kuriyagawa, K. Syoji, K. Tanaka, J. Yan, N. Wajima and I. Miyoshi: J. JSPE Vol. 64 (1998), pp.1350-54.

Google Scholar

[2] H. Huang, W. K. Chen, L. Yin, Z.J. Xiong, Y.C. Liu and P.L. Teo: Prec. Eng. Vol. 28 (2004), pp.95-105.

Google Scholar

[3] W.K. Chen, T. Kuriyagawa, H. Huang and N. Yoshihara: Prec. Eng. Vol. 29 (2005), pp.315-323.

Google Scholar

[4] K.L. Blaedel, J.S. Taylor and C.J. Evans: in Machining of Ceramics and Composites, edited by S. Jahanmir, M. Ramulu and P. Koshy, Marcel Dekker, Inc., 1999, pp.139-176.

Google Scholar

[5] I. Inasaki: Annals of CIRP Vol. 36 (1987), pp.463-471.

Google Scholar

[6] S. Malkin and T.W. Hwang: Annals of CIRP Vol. 45/2 (1996), pp.569-580.

Google Scholar

[7] S. Jahanmir, H. H. K. Xu and L. K. Ives: in Machining of Ceramics and Composites, edited by S. Jahanmir, M. Ramulu & P. Koshy, Marcel Dekker, Inc., 1999, pp.11-84.

Google Scholar

[8] L. Zhou, J. Shimizu and H. Eda: Key Eng. Mater. Vol. 257-258 (2004), pp.101-106.

Google Scholar

[9] T.G. Bifano: Ductile-regime grinding of brittle materials, PhD Thesis, North Carolina State University, Raleigh, NC, (1988).

Google Scholar

[10] H. Huang and T. Kuriyagawa: Proceedings of the International Conference on Leading Edge Manufacturing in 21 st Century Vol. 2, Nagoya, Japan, 20-22 October 2005, pp.877-882.

Google Scholar

[11] G.S. Upadhyaya: Cemented Tungsten Carbides, Production, Properties and Testing, Culinary and Hospitality Industry Publications Services, Texas, (2005).

Google Scholar

[12] W.C. Oliver and G.M. Pharr: J. Mater. Res. Vol. 19 (2004), pp.3-20.

Google Scholar

[13] L. Yin, J.P. Pickering, K. Ramesh, H. Huang, E. Vancoille and A. Sponwage: Proc. Institu. Mech. Eng., Part B: J. Eng. Manuf. Vol. 218 (2004), pp.419-429.

Google Scholar