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HomeKey Engineering MaterialsKey Engineering Materials Vols. 336-338Fabrication of Heater Element in Release System

Fabrication of Heater Element in Release System

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High-Performance Ceramics IV

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Periodical:

Key Engineering Materials (Volumes 336-338)

Pages:

769-771

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.336-338.769

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Online since:

April 2007

Authors:

Yu Zhen Zhao, Jun Zhang, He Ping Zhou

Keywords:

Aluminum Nitride (AlN), Heater Element, Pt Paste

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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[1] Y.L. Li: Electrical Element of Think Film (South China Technical University Press, Guangzhou 1991).

[2] C. Alphonso. Stewart and H. Jason Hair: Proceedings of the 36 th Aerospace Mechanisms Symposium, Glenn Research Center, May 15~17, (2002), p.263.

[3] M.B. Tian: Electronic Packaging Technology (Tsinghua university publications, Beijing 2000). Fig. 4 SEM micrograph of AlN heater element surface Fig. 5 SEM micrograph of AlN-Pt bonding face Fig. 6 SEM micrograph of Si3N4 heater element surface Fig. 7 SEM micrograph of Si3N4-Pt bonding face

DOI: 10.7717/peerj.1277/supp-1