Fabrication of Heater Element in Release System

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Periodical:

Key Engineering Materials (Volumes 336-338)

Edited by:

Wei Pan and Jianghong Gong

Pages:

769-771

DOI:

10.4028/www.scientific.net/KEM.336-338.769

Citation:

Y. Z. Zhao et al., "Fabrication of Heater Element in Release System", Key Engineering Materials, Vols. 336-338, pp. 769-771, 2007

Online since:

April 2007

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[1] Y.L. Li: Electrical Element of Think Film (South China Technical University Press, Guangzhou 1991).

[2] C. Alphonso. Stewart and H. Jason Hair: Proceedings of the 36 th Aerospace Mechanisms Symposium, Glenn Research Center, May 15~17, (2002), p.263.

[3] M.B. Tian: Electronic Packaging Technology (Tsinghua university publications, Beijing 2000). Fig. 4 SEM micrograph of AlN heater element surface Fig. 5 SEM micrograph of AlN-Pt bonding face Fig. 6 SEM micrograph of Si3N4 heater element surface Fig. 7 SEM micrograph of Si3N4-Pt bonding face.

DOI: 10.7717/peerj.1277/supp-1

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