Damage Mechanics of Solder Joints under High Current Density

Cemal Basaran

doi:10.4028/www.scientific.net/KEM.345-346.1403

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Reliability Evaluation of Hydrothermal Crystallization on Plasma-Sprayed HA Coatings by the Weibull Model
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Vibration Fatigue Reliability of Lead and Lead-Free Solder Joint by FORM/SORM
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Damage Mechanics of Solder Joints under High Current Density
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The Effect of a Free Drop Impact on the Bolted Joint of the Radioactive Transport Package
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Damage Mechanics of Solder Joints under High Current Density

Abstract:

In this paper, Moiré interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (104A/cm2). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moiré interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.