Nanomechanical Properties and Nanostructure of CMG and CMP Machined Si Substrates

Abstract:

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Silicon (100) substrates machined by chemo-mechanical-grinding (CMG) and chemicalmechanical- polishing (CMP) were investigated using atomic force microscopy, cross-sectional transmission electron microscopy and nanoindentation. It was found that the substrate surface after CMG was slightly better than machined by CMP in terms of roughness. The transmission electron microscopy analysis showed that the CMG-generated subsurface was defect-free, but the CMP specimen had a crystalline layer of about 4 nm in thickness on the top of the silicon lattice as evidenced by the extra diffraction spots. Nanoindentation results indicated that there exists a slight difference in mechanical properties between the CMG and CMP machined substrates.

Info:

Periodical:

Key Engineering Materials (Volumes 381-382)

Edited by:

Wei Gao, Yasuhiro Takaya, Yongsheng Gao and Michael Krystek

Pages:

525-528

DOI:

10.4028/www.scientific.net/KEM.381-382.525

Citation:

B.L. Wang et al., "Nanomechanical Properties and Nanostructure of CMG and CMP Machined Si Substrates", Key Engineering Materials, Vols. 381-382, pp. 525-528, 2008

Online since:

June 2008

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Price:

$35.00

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