For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Study on Cutting of Micro Channel by End Mill with Small Diameter
p.351
Study on Ultra Precision Polishing of Single Crystal Diamond Substrates under Ultraviolet Irradiation
p.355
Ultra-Precision Machining of Dies for Microlens Arrays Using a Diamond Cutting Tool
p.359
Micro Machining of Three-Dimensional Microstructure with the Tiny-Grinding Wheel Based on the Electro-Magneto-Rheological Effect
p.363
Effect of Potential Function on Molecular Dynamics Simulation of Copper Processing
p.368
Improvement of Thickness Uniformity of Bulk Silicon Wafer by Numerically Controlled Local Wet Etching
p.372
Figuring of Elliptical Neutron Focusing Mirror Using Numerically Controlled Local Wet Etching
p.376
Ultra Precision Diamond Shaping of an Elliptical Micro-Lens Array
p.380
Mirror Finishing of Austenitic Stainless Steel with a Cermet Insert
p.384

Effect of Potential Function on Molecular Dynamics Simulation of Copper Processing

Article Preview

Abstract:

In nanometric cutting process, the actual material removal can take place at atomic level, which makes it difficult or impossible to observe the machining phenomena and measure the cutting parameters in experiments. However, it is crucial to investigate the cutting process in nanoscale. In this study, the molecular dynamics (MD) method is employed to model and simulate the process of cutting monocrystalline copper. The two-body Morse potential and the many-body EAM potential are used for the atoms interaction in the workpiece to study the effect of different potential function on the simulation results. It is found that there are no obvious differences in the chip formation between Morse and EAM potential, but the Morse potential results in higher potential energy and more chips generated in the cutting process.

You might also be interested in these eBooks
Progress of Machining Technology View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 407-408)

Pages:

368-371

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.407-408.368

Citation:

Cite this paper

Online since:

February 2009

Authors:

Jia Chun Wang, Ji Min Zhang, Na Li, Yun Peng Kou

Keywords:

EAM, MD Simulation, Morse, Nanometric Cutting Model

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2009 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] T. H. Fang and C. I. Weng: Nanotechnology, vol. 11 (2000), pp.148-151.

Google Scholar

[2] J. D. Kim and C. H. Moon: J. Material Process Technology, vol. 59(1996), pp.309-311.

Google Scholar

[3] X. S. Han, B. Lin, S. Y. Yu and S. X. Wang: J. material process technology, vol. 129(2002), pp.105-107.

Google Scholar

[4] M. B. Cai, X. P. Li and M. Rahman: Int. J. Machine Tools Manufacture, vol. 47(2007), pp.75-78.

Google Scholar

[5] K Maekawa and A. Itoh: Wear, vol. 188 (1995), pp.115-116.

Google Scholar

[6] R. Komanduri, N. Chandrasekaran and L.M. Raff: Wear, vol. 240(2000), pp.60-63.

Google Scholar

[7] Y. Lin and T. Inamura: JSME, Vol. 49 (2006), pp.70-74.

Google Scholar

[8] Q. X. Pei, C. Lu, F. Z. Fang and H. wu: Computational Material Science, Vol. 37 (2006), pp.434-437.

Google Scholar

[9] M. S. Daw, S. M. Foiles and M. I. Baskes: Mater. Sci., Vol. 9 (1993), pp.251-253.

Google Scholar

[10] F. Z. Fang, H. Wu, W. Zhou and X. T. Hu: J. Material Processing Technology, Vol. 184 (2007) pp.407-410.

Google Scholar

[11] J. D. Kim and C. H. Moon: J. Material Process Technology, Vol. 59 (1996).

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.