Ice fixed abrasives (IFA) polishing is a novel ultra-precision machining method. The motion tracks of abrasives during IFA polishing have an important effect on the quality of the machined silicon wafer. Firstly, the motion tracks of IFA polishing are theoretically analyzed in this paper. It is founded that the paths of any point in the IFA polishing pad relative to the wokpiece are a group of cycloids. Then, the motion tracks of single abrasive and multiple abrasives in the IFA polishing pad are simulated respectively. The results show that increasing the eccentricity is beneficial to the enlargement of the size range of polishing process. With the increasing of the speed ratio between the IFA polishing pad and the workpiece, the abrasive at higher speed can leave longer tracks on the workpiece than that at lower speed at the same time. The more the abrasives, the more uniform the mark density under the influence of more abrasives.