Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries

Abstract:

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With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn2O3 abrasives potential to replace disappearing CeO2 for the polishing of glass substrates.

Info:

Periodical:

Key Engineering Materials (Volumes 447-448)

Edited by:

Jianhong Zhao, Masanori Kunieda, Guilin Yang and Xue-Ming Yuan

Pages:

141-145

DOI:

10.4028/www.scientific.net/KEM.447-448.141

Citation:

T. Yamazaki et al., "Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries", Key Engineering Materials, Vols. 447-448, pp. 141-145, 2010

Online since:

September 2010

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Price:

$35.00

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