Investigation of Copying Rate of Tool Motions on Workpiece Profile
p.121
p.121
Efficiency and Wear Behavior of the Abrasive Flow Machining Processing
p.126
p.126
Development and Test of CVD-Diamond Microgrinding Wheels
p.131
p.131
Analysis of Motion Trajectory and Dwell Time of Abrasive in Magnetorheological Finishing with Tiny-Grinding Wheel Cluster
p.136
p.136
Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries
p.141
p.141
Advanced Lapping and Polishing Methods for Planarizing a Single-Crystal 4H-Sic Utilizing Fe Abrasive Particles
p.146
p.146
Methods for Prevention of Ignition during Machining of Magnesium Alloys
p.150
p.150
Ultraprecision ELID-Grinding of Aspheric WC Lens Mold for Plastic Injection Molding
p.155
p.155
Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper
p.159
p.159
Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries
Abstract:
With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn2O3 abrasives potential to replace disappearing CeO2 for the polishing of glass substrates.
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Periodical:
Key Engineering Materials (Volumes 447-448)
Pages:
141-145
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Online since:
September 2010
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© 2010 Trans Tech Publications Ltd. All Rights Reserved
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