Accuracy Correction of the Measuring Method for Film Stress Gradient Based on Curvature Radius

Hua Rong; Chang Ling Yu

doi:10.4028/www.scientific.net/KEM.503.381

Paper Titles

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 503Accuracy Correction of the Measuring Method for...

Accuracy Correction of the Measuring Method for Film Stress Gradient Based on Curvature Radius

Abstract:

Stress gradient of a thin film along its thickness direction has important influence on performance of MEMS/NEMS devices. The measuring method based on curvature radius is a usual method for extracting film stress gradient. In this paper the error of the method has been analyzed using Finite Element Analysis software Coventorware, and the current theory has been modified according to FEA results to enhance its accuracy. Simulating results indicated that the accuracy of the method has been increased observably after correcting.

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Periodical:

Key Engineering Materials (Volume 503)

Pages:

381-385

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.503.381

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Online since:

February 2012

Authors:

Hua Rong, Chang Ling Yu

Keywords:

Accuracy Correction, Curvature Radius, Stress Gradient Measuring

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