Effects of Different Package Structures on Thermal Properties of High Power White LED

Zhe Ran Sun; Da Ming Wu; Ya Jun Zhang; Jian Zhuang; Kai Fang Dang

doi:10.4028/www.scientific.net/KEM.503.397

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 503Effects of Different Package Structures on Thermal...

Effects of Different Package Structures on Thermal Properties of High Power White LED

Abstract:

The characteristics of several package structures of high power white Light emitting diode (LED) are described in this paper. The influence of different structures on thermal properties is analyzed. Forward voltage method is used to test the thermal resistance of LED chips.

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Periodical:

Key Engineering Materials (Volume 503)

Pages:

397-401

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.503.397

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Online since:

February 2012

Authors:

Zhe Ran Sun, Da Ming Wu, Ya Jun Zhang, Jian Zhuang, Kai Fang Dang

Keywords:

High Power White LED, Package, Thermal Property

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References

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