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HomeKey Engineering MaterialsKey Engineering Materials Vol. 533Characterisation of Interfacial Adhesion of Thin...

Characterisation of Interfacial Adhesion of Thin Film/Substrate Systems Using Indentation-Induced Delamination: A Focused Review

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Abstract:

This review summarized the research works on the characterisation of interfacial adhesion in thin film/substrate bilayer structure by use of indentation testing. It focused on the delamination mechanics between a thin film and a substrate induced by indentation and the quantitative characterisation of interfacial strength in such bilayer systems. Three major techniques were introduced, namely conventional indentation, cross-sectional indentation and acoustic emission assisted indentation. A number of theoretical models and finite element simulation studies were discussed, in association with the experimental investigations. Key words: Thin film, bilayer, delamination, adhesion, indentation, acoustic emission

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Periodical:

Key Engineering Materials (Volume 533)

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201-222

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https://doi.org/10.4028/www.scientific.net/KEM.533.201

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Online since:

December 2012

Authors:

Ming Yuan Lu, Hong Tao Xie, Han Huang

Keywords:

Acoustic Emission (AE), Adhesion, Bilayer, Delamination, Indentation, Thin Film

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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