Controlled Synthesis of Surface-Clean Monolayer Graphene
p.85
p.85
Cu (II) as a Catalyst for Hydrogen Peroxide System Abrasive-Free Polishing on Hard Disk Substrate
p.91
p.91
Evaluation Methods on Adhesion Property between SU-8 Photoresist and Metal Substrate
p.96
p.96
Fabrication and Properties of a New Type Micro Super-Capacitor
p.102
p.102
FEM Simulation of the Thermo-Mechanical Behavior of TSV 3D MEMS Structure
p.108
p.108
Numerical Analysis of Molding Process for Roll Imprinting Based on ABAQUS
p.114
p.114
On the Test Method of Dynamic Characteristics of MEMS Components
p.119
p.119
Research on Machining Method of Spatial Rotary Curved Surface
p.125
p.125
Research on the PDMS Surface Modification Technique
p.131
p.131
FEM Simulation of the Thermo-Mechanical Behavior of TSV 3D MEMS Structure
Abstract:
As pitch of TSV shrinks down, mechanical characteristics of TSVs become more complicated and the heat of chip becomes a critical issue. The objective of this paper is to study thermal mechanical characteristics of ultra-fine pitch TSV. The thermal-mechanical characterization of an ultra-fine pitch chip is simulated with FEA.
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Periodical:
Key Engineering Materials (Volumes 562-565)
Pages:
108-113
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Online since:
July 2013
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© 2013 Trans Tech Publications Ltd. All Rights Reserved
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