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HomeKey Engineering MaterialsKey Engineering Materials Vols. 562-565Evaluation Methods on Adhesion Property between...

Evaluation Methods on Adhesion Property between SU-8 Photoresist and Metal Substrate

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Abstract:

During the fabrication process of metal microdevice by SU-8 UV-LIGA technology, due to the poor adhesion strength between SU-8 photoresist and metal substrate it is common for interface separated and bind failure. In this paper pull-off test, scratch test and indentation test were performed to evaluate the adhesion property between SU-8 photoresist and metal substrate, and the feasibility of these three methods was compared. The result shows that the pull-off test fails to evaluate real interface adhesion strength because of the great possibilities of mixed debond appearance which makes the experimental data discrete and inaccurate. The scratch test and the indentation test can efficiently and accurately evaluate the interface adhesion strength between SU-8 photoresist and metal substrate and are demonstrated two preferable methods.

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Micro-Nano Technology XIV

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Periodical:

Key Engineering Materials (Volumes 562-565)

Pages:

96-101

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.562-565.96

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Cite this paper

Online since:

July 2013

Authors:

Xiao Lei Zhang, Li Qun Du, Ao An Wang

Keywords:

Adhesion Property, Indentation Test, Metal Substrate, Pull-Off Test, Scratch Test, SU-8 Photoresist

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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