Effect of Silicon Compounds on the Properties of Pressureless Sintered Aluminum Nitride

Abstract:

In this paper, the aluminum nitride (AlN) was fabricated by pressureless sintering with YF3 and various silicon compounds as the sintering aids. The phase, microstructure, density and thermal conductivity were characterized by XRD, SEM and laser thermal diffusivity method. The sample densities were detected varied from 3.17 to 3.30g/cm3 and room-temperature thermal conductivity varied from 196 to 233 W/m·K. Samples sintered with YF3 additives have the highest thermal conductivity. The sintering aids with SiO2, Si3N4 and SiC would decrease the density and the thermal conductivity obviously, and also change the fracture mode from the intergranular to transgranular , which is a key for the toughness of the AlN substrate.

• Periodical: Key Engineering Materials (Volumes 602-603)
• Pages: 565-569
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.602-603.565
• Online since: March 2014
• Authors: Chang Lu Fu, Shang Hua Wu, Yan Ling Cheng*, Jun Yu Fu, Ruo Jun Wu, Zhong Yong Lu
• Keywords: Aluminum Nitride (AlN), Silicon Compounds, Thermal Conductivity (TC)

References

[1] Nobuko S. VanDamme, Sarah M. Richard. Liquid-Phase Sintering of Aluminum Nitride by Europium Oxide Additives, J. Am. Ceram. Soc. 72 (1989) 1409-1414.

DOI: 10.1111/j.1151-2916.1989.tb07662.x

[2] Yasuhiro Shimizu, Ion-Exchange Loading of Yttrium Acetate as a Sintering Aid on Aluminum Nitride Powder via Aqueous Processing, J. Am. Ceram. Soc. 83(2000) 2793-97.

DOI: 10.1111/j.1151-2916.2000.tb01633.x

[3] Xiulan He, Feng Ye, Haijiao Zhang, Zhiqiang Zhou, Study on microstructure and thermal conductivity of Spark plasma Sintering AlN ceramics, Materials and Design. 9(2010) 4110-4115.

DOI: 10.1016/j.matdes.2010.04.046

[4] A. Franco Junior, D. J Shanafield, Thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics, Ceramica. (2004) 247-253.

DOI: 10.1590/s0366-69132004000300012

[5] Qiao Liang , Zhou He-ping, Migration of Liquid Phase in Low-temperature Sintering of AlN, Journal of the European Society. (2000) 7-10.

[6] Susana Maria Olhero, Thermodynamic Studies on the AlN Sintering Powders Treated With Phosphate Species, J. Am. Ceram. Soc. 90(2007) 3589-3595.

DOI: 10.1111/j.1551-2916.2007.01922.x

[7] Ichinose N, Effect of carbon-reducing atmosphere on the properties of aluminum nitride (AlN), J. Materials Chemistry and Physiscs. 42(1995) 176-180.

DOI: 10.1016/0254-0584(95)01572-8

[8] PS Baranda, AK Knudsen, E Ruh, Effect of CaO on the Thermal Conductivity of Aluminum Nitride,J. Am. Ceram. Soc. 76(1989) 1751-60.

[9] TB Trozyski, PS Nicholson, Effect of Additives on the Pressureless Sintering of Aluminum Nitride between 1500°C and 1800°C, J. Am. Ceram. Soc. 72(1989) 1488-91.

[10] Takeshi Yagi, Effect of Silicon Dioxide on the Thermal Diffusivity of Aluminum Nitride Ceramics, J. Am. Ceram. Soc. 71 (1988) C-334-C-338.

[11] Komatsu, Michiyashu, EUROPEAN 0, 626, 359 . (1994).

[12] Susana Maria Olhero, Thermodynamic Studies on the AlN Sintering Powders Treated With Phosphate Species, J. Am. Ceram. Soc. 90(2007) 3589-3595.

DOI: 10.1111/j.1551-2916.2007.01922.x

[13] J. Jarrige, J.P. Lecompte, Effect of Oxygen on the Thermal Conductivity of Aluminum Nitride Ceramics, Journal of the European Society. 17 (1997) 1891-1895.

DOI: 10.1016/s0955-2219(97)00078-2

[14] Yasuhiro Kurokawa, Development and Microstructural Characterization of High-Thermal- Conductivity Aluminum Nitride Ceramics, J. Am. Ceram. Soc. 71(1988) 588-94.

[15] Ran-Rong Lee, Development of High Thermal Conductivity Aluminum Nitride Ceramic, J. Am. Ceram. Soc. 74 (1991) 2242-49.

[16] Zhao Wenming, Zhai Changsheng, Wang Jun, Study progress of the toughening and strenghening mechanisms of Ceramic Nanocomposites, MATERIALS REVIEW, 19 (2005) 173-176.