AlN/CNT Composites Ceramics by Spark Plasma Sintering

Hai Long Liang; Chun Peng Wang; Yan Li Huo; Chuan Qi Hu; Xiao Ting Huang; Jie Tang

doi:10.4028/www.scientific.net/KEM.602-603.570

Paper Titles

Fabrication and Ablation Behavior of Plasma Sprayed ZrC-W Composite Coatings
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Effect of Composite Sintering Aids on the Thermal and Mechanical Properties of Hot-Pressed Aluminum Nitride
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Effect of Silicon Compounds on the Properties of Pressureless Sintered Aluminum Nitride
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AlN/CNT Composites Ceramics by Spark Plasma Sintering
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Growth of AlN Films on Silicon Substrates by Radio Frequency Magnetron Sputtering
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Effect of Ni Coated SiC on Mechanical Properties of SiC/Fe Composites
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Preparation of SiCp/Al Functionally Gradient Composites
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Effect of Amorphous Phase on Mechanical Properties of SiC/Cu Composites
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 602-603AlN/CNT Composites Ceramics by Spark Plasma...

AlN/CNT Composites Ceramics by Spark Plasma Sintering

Abstract:

Highly dense AlN/CNT composite ceramics with 1-10% volume fractions of CNT were fabricated by spark plasma sintered (SPS) at 1400°C-1700°C. The results indicated that origination diameter of AlN had a great effect on microstructure and thermal conductivity. In details, for the system with AlN origination diameter of nanosized, the tubular structure of CNT has not been destructed, but when micro-sized AlN powder was adopted, the structure of CNT showed unstable at high temperature. Even though the degradation with incorporation of CNT into AlN, thermal conductivity of sintered AlN/CNT composites ceramics was evidently improved by adjusting content of additive Y₂O₃ and the sintering process. Both the real part and imaginary part of the composites of Ka-Band (26.540.0 GHz) increase with the increase of CNT content, in which the increase of imaginary part is more than that of real part, resulting in an increase of loss factor. The AlN/ CNT thermal conductivity composites with appropriate CNT content and sintering temperature possess good dielectric dissipation and thermal conductivity.

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Periodical:

Key Engineering Materials (Volumes 602-603)

Pages:

570-573

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.602-603.570

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Online since:

March 2014

Authors:

Hai Long Liang, Chun Peng Wang, Yan Li Huo, Chuan Qi Hu*, Xiao Ting Huang, Jie Tang

Keywords:

Aluminum Nitride (AlN), Carbon Nanotube (CN), Dielectric Property, SPS, Thermal Conductivity (TC)

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* - Corresponding Author

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