Kinematic Analysis of Ultrasonic Vibration Assisted Micro End Grinding

Jian Hua Zhang; Yan Zhao; Shuo Zhang; Zhi Wei

doi:10.4028/www.scientific.net/KEM.609-610.1357

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610Kinematic Analysis of Ultrasonic Vibration...

Kinematic Analysis of Ultrasonic Vibration Assisted Micro End Grinding

Abstract:

A new processing method, ultrasonic vibration assisted micro end grinding (UAMEG), is proposed to improve micro grinding technology, aiming at machining of brittle-rigid material micro components. Trajectories of adjacent two abrasive were modeled and simulated to perform kinematic investigation and mechanism analysis. The critical condition of regular high-frequency abrasive-workpiece separation (AWS) is obtained and proved to be: the frequency coefficient (K) is a positive integer. The effect of K is investigated. Cutting force and temperature reducing, smooth chip evacuation, tool life prolongation and machining accuracy improvement can be achieved in UAMEG from the kinematics point of view.

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Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

1357-1361

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.1357

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Online since:

April 2014

Authors:

Jian Hua Zhang, Yan Zhao*, Shuo Zhang, Zhi Wei

Keywords:

Kinematic Analysis, Micro Grinding, Trajectory Model, Ultrasonic Vibration

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* - Corresponding Author

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