The Effect of Deposition Time on the Voltage Range and Sensitivity of Cu/Ni as Low-Temperature Sensor Resulted from Electroplating Assisted by a Transverse Magnetic Field

Abstract:

The Cu/Ni thin film as low-temperature sensor was produced by electroplating on the various deposition times assisted with a 200G magnetic field in the transverse direction to the surface of Cu. The deposition time was varied from 0 to 45s. The liquid nitrogen (LN2) 0°C to -200°C was used as a tested low-temperature medium. The characterization was done on the voltage range and sensitivity. Cu/Ni sensor from deposition within 25s has the largest voltage range that is 128.48 mV and has the sensitivity (S) that has a linear relationship with temperature (T) according to S(T) = 0.287 - 0.002T.

• Periodical: Key Engineering Materials (Volume 855)
• Pages: 185-190
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.855.185
• Online since: July 2020
• Authors: Moh. Toifur*, Mutia Lutfia Khansa, Okimustava Okimustava, Azmi Khusnani, Ridwan Ridwan
• Keywords: Cu/Ni Thin Film, Electroplating, Magnetic Field, Sensitivity, Voltage Range

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