[1]
M. Cabello, V. Soler, G. Rius, J. Montserrat, J. Rebollo and P. Godignon: Mater. Sci. Semicond. Process. Vol. 78 (2018), p.22.
Google Scholar
[2]
P. Fiorenza, F. Giannazzo and F. Roccaforte: Energies Vol. 12 (2019), p.2310.
Google Scholar
[3]
D. Okamoto, H. Yano, T. Hatayama, Y. Uraoka and T. Fuyuki: IEEE Trans. Electron Devices Vol. 55 (2008), p. (2013).
DOI: 10.1109/ted.2008.926639
Google Scholar
[4]
L. C. Martin, D. Clark, E. P. Ramsay, A. E. Murphy, R. F. Thompson, D. A. Smith, R. A. R. Young, J. D. Cormack, N. G. Wright and A. B. Horsfall: Mater. Sci. Forum Vol. 740742 (2013), p.891.
Google Scholar
[5]
A. Salinaro, G. Pobegen, T. Aichinger, B. Zippelius, D. Peters, P. Friedrichs and L. Frey: IEEE Trans. Electron Devices Vol. 62 (2015), p.155.
DOI: 10.1109/ted.2014.2372874
Google Scholar
[6]
M. Ekström, B. G. Malm and C.M. Zetterling: IEEE Electron Device Lett. Vol. 40 (2019), p.670.
Google Scholar
[7]
M. Ekström: SiC CMOS and memory devices for hightemperature integrated circuits (KTH Royal Institute of Technology, Stockholm, Sweden 2019). Available from http://urn.kb.se/ resolve?urn=urn:nbn:se:kth:diva-250276.
Google Scholar
[8]
G. Groeseneken, H. E. Maes, N. Beltran and R. F. De Keersmaecker: IEEE Trans. Electron Devices Vol. 31 (1984), p.42.
DOI: 10.1109/t-ed.1984.21472
Google Scholar
[9]
R. E. Paulsen and M. H. White: IEEE Trans. Electron Devices Vol. 41 (1994), p.1213.
Google Scholar
[10]
D. Bauza and G. Ghibaudo: SolidState Electron. Vol. 39 (1996), p.563.
Google Scholar
[11]
C. J. Scozzie and J. M. McGarrity: Mater. Sci. Forum Vol. 264268 (1998), p.985.
Google Scholar
[12]
A. J. Lelis and R. Green and D. B. Habersat: Mat. Sci. Semicon. Proc. Vol. 78 (2018), p.32.
Google Scholar
[13]
Norstel AB, Linköping, Sweden. Homepage: http://www.norstel.com/. Accessed 20190828.
Google Scholar
[14]
J. Woerle, M. Camarda, C. W. Schneider, H. Sigg, U. Grossner and J. Gobrecht: Mater. Sci. Forum Vol. 897 (2017), p.119.
DOI: 10.4028/www.scientific.net/msf.897.119
Google Scholar
[15]
M. Okamoto, M. Tanaka, T. Yatsuo and K. Fukuda: Appl. Phys. Lett. Vol. 89 (2006), p.023502.
Google Scholar
[16]
M. Okamoto, M. Iijima, T. Yatsuo, K. Fukuda and H. Okumura: Mater. Sci. Forum Vol. 645648 (2010), p.995.
Google Scholar
[17]
M. Noborio, J. Suda, S. Beljakowa, M. Krieger and T. Kimoto: Phys. Status Solidi A Vol. 206 (2009), p.2374.
DOI: 10.1002/pssa.200925247
Google Scholar
[18]
M. Lenzlinger and E. H. Snow: J. Applied Phys. Vol. 40 (1969), p.278.
Google Scholar
[19]
V. V. Afanas'ev, F. Ciobanu, S. Dimitrijev, G. Pensl and A. Stesmans: J. Phys.: Condens. Matter Vol. 16 (2004), p. S1839.
DOI: 10.1088/0953-8984/16/17/019
Google Scholar
[20]
Y. Matsuya, X. Zhang, D. Okamoto, N. Iwamuro and H. Yano, poster presentation at the International Conference of Silicon Carbide and Related Materials, Kyoto, Japan, (2019).
Google Scholar
[21]
D. K. Schroder: Semiconductor Material and Device Characterization, 3rd ed. , John Wiley & Sons, New Jersey (2006).
Google Scholar
[22]
M. Hori, T. Tsuchiya and Y. Ono: Appl. Phys. Express Vol. 10 (2017), p.015701.
Google Scholar
[23]
M. A. Anders, P. M. Lenahan and A. J. Lelis: Mater. Sci. Forum Vol. 924 (2018), p.469.
Google Scholar
[24]
A. S. Grove and D. J. Fitzgerald: SolidState Electron. Vol. 9 (1966), p.783.
Google Scholar
[25]
J. W. McPherson: Reliability Physics and Engineering: TimeToFailure Modeling, Springer, New York (2010).
Google Scholar