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HomeMaterials Science ForumMaterials Science Forum Vol. 1010The Preliminary Study of the Addition Zinc in...

The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder

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Abstract:

Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu₆Sn₅is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu₆Sn₅and Cu₅Zn₈as shown in the XRD analysis result.

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Periodical:

Materials Science Forum (Volume 1010)

Pages:

104-108

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1010.104

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Online since:

September 2020

Authors:

Wei Yee Wong, Rabiatul Adawiyah Shamsudin, Muhammad Firdaus Mohd Nazeri, Mohamad Najmi Masri*

Keywords:

Corrosion, Lead Free Solder, Tin-Copper, Zinc

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© 2020 Trans Tech Publications Ltd. All Rights Reserved

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