The Effect of Al Micro-Alloying on Corrosion and Thermal Properties of Sn-Zn Alloy

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Abstract:

Electrochemical corrosion behavior of Sn–Zn solder alloys in 6 M potassium hydroxide solution was investigated by potentiodynamic polarization technique, aiming to investigate the role of Al additions. The effect of micro-alloying Al on the thermal properties was also studied by using DSC. The results reveal that the presence of Al content leads to increasing in corrosion potential yet reducing the corrosion current density and passivation current density, simultaneously. XRD analysis reveals the failure to produce new compound with Zn, limits the effect of adding Al towards the corrosion performance. Yet, significant improvement on thermal properties were seen, especially on the melting temperature and pasty range without modifying the eutectic melting behavior.

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Materials Science Forum (Volume 1010)

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98-103

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September 2020

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© 2020 Trans Tech Publications Ltd. All Rights Reserved

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[1] M. Abtew, G. Selvaduray, Lead-free solders in microelectronics, Mater. Sci. Eng. R-Rep., 27 (2000) 95-141.

DOI: 10.1016/s0927-796x(00)00010-3

Google Scholar

[2] N. Jumali, A.A. Mohamad, M. Nazeri, M. Firdaus, Corrosion Properties of Sn-9Zn Solder in Acidic Solution, in: Materials Science Forum, Trans Tech Publ, 2017, pp.365-372.

DOI: 10.4028/www.scientific.net/msf.888.365

Google Scholar

[3] L. Tsao, Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging, Corrosion Resistance, (2012) 107-132.

DOI: 10.5772/33228

Google Scholar

[4] H. Wang, S. Xue, W. Chen, J. Wang, Effect of Ag, Al, Ga addition on wettability of Sn-9Zn lead-free solder, TRANSACTIONS-CHINA WELDING INSTITUTION, 28 (2007) 33.

Google Scholar

[5] C. Yang, F. Song, S.R. Lee, Effect of interfacial strength between Cu 6 Sn 5 and Cu 3 Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish, in: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), IEEE, 2011, pp.971-978.

DOI: 10.1109/ectc.2011.5898627

Google Scholar

[6] K.-L. Lin, F.-C. Chung, T.-P. Liu, The potentiodynamic polarization behavior of Pb-free XIn-9 (5Al-Zn)-YSn solders, Mater. Chem. Phys., 53 (1998) 55-59.

DOI: 10.1016/s0254-0584(97)02062-2

Google Scholar

[7] M.N. Mohamed, N. Ab Aziz, A.A. Mohamad, M.F.M. Nazeri, Polarization Study of Sn-9Zn and Sn-37Pb Solders in Hydrochloric Acid Solution, Int. J. Electroactive Mater, 3 (2015) 28-32.

Google Scholar

[8] N. Jumali, M.H. Zainol, A.A. Mohamad, M. Nazeri, M. Firdaus, Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution, in: Solid State Phenomena, Trans Tech Publ, 2018, pp.46-50.

DOI: 10.4028/www.scientific.net/ssp.273.46

Google Scholar

[9] M.F.M. Nazeri, A.A. Mohamad, Polarization Study of Sn-9Zn Lead-free Solder in KOH Solutions, Int. J. Electroactive Mater, 2 (2014) 34-39.

Google Scholar

[10] J.-C. Liu, G. Zhang, J.-S. Ma, K. Suganuma, Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure, Journal of Alloys and Compounds, 644 (2015) 113-118.

DOI: 10.1016/j.jallcom.2015.04.168

Google Scholar

[11] M.F.M. Nazeri, M.G. Affendy, A.A. Mohamad, Corrosion Study of Sn-9Zn Lead-Free Solder in Alkaline Solution, Int. J. Electrochem. Sci, 7 (2012) 4182-4191.

Google Scholar

[12] M.F. Mohd Nazeri, M.Z. Yahaya, A. Gursel, F. Cheani, M.N. Masri, A.A. Mohamad, Corrosion characterization of Sn-Zn solder: a review, Soldering & Surface Mount Technology, 31 (2019) 52-67.

DOI: 10.1108/ssmt-05-2018-0013

Google Scholar