Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior

Anna Hashimoto; Shu Bin Liu; Ikuo Shohji; Tatsuya Kobayashi; Junichiro Hirohashi; Tsunehito Wake; Susumu Arai; Yuichiro Kamakoshi

doi:10.4028/www.scientific.net/MSF.1016.522

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HomeMaterials Science ForumMaterials Science Forum Vol. 1016Brazing of Stainless Steel Using Electrolytic Ni-P...

Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior

Abstract:

Electrodeposited Ni-11 mass%P alloy plating film was fabricated on the surface of stainless steel SUS304 to conduct brazing of SUS304 plates for a heat exchanger. Brazing of SUS304 plates with electrodeposited Ni-11P layers was carried out using a hydrogen reducing furnace. The microstructure and joint strength of the brazed joint were also investigated. From the result of the microstructural observation of the cross section of the joint, it was found that the brazing filler metal is homogeneously distributed without defects such as voids between the SUS304 plates. The results of electrochemical measurements showed that the P-concentrated phase in the Ni-11P alloy is preferentially dissolved in NaCl aqueous solution.

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Periodical:

Materials Science Forum (Volume 1016)

Pages:

522-527

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1016.522

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Online since:

January 2021

Authors:

Anna Hashimoto*, Shu Bin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi

Keywords:

Electrochemical Measurement, Electrodeposited Alloy Plating, Nickel Brazing Filler Metals, Ni-P, SUS304

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